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PFEM을 이용한 Process FMEA 수행 사례 연구
차봉환(Bong Hwan Cha),강지호(Ji Ho Kang),안동근(Dong Geun Ahn),장중순(Joong Soon Jang) 대한산업공학회 2012 대한산업공학회 추계학술대회논문집 Vol.2012 No.11
FMEA is now considered a prerequisite tool for design, control and improvement. To perform FMEA, a systematic procedure is needed in identifying failure modes, mechanisms and causes. This study is to propose a procedural model for process FMEA based on process function and equipment model (PFEM) which represents the mapping between process functions and corresponding equipments. Such a method may be useful for the equipment focused manufacturing processes like chemical plants. An actual case study is also given.
PFEM을 이용한 Process FMEA 수행 방법 연구
안동근 ( Dong-geun Ahn ),차봉환 ( Bong-hwan Cha ),장중순 ( Joong-soon Jang ) 대한설비관리학회 2020 대한설비관리학회지 Vol.25 No.3
FMEA is now considered a prerequisite tool for design, control and improvement. To perform FMEA, a systematic procedure is needed in identifying failure modes, mechanisms and causes. Results prepared in accordance with the previously widely used process FMEA implementation procedure are easy to integrate potential failure modes and causes of each process. However, there are difficulties in situations in which specific failure modes need to be managed intensively. This study is to propose a procedural model for process FMEA based on process function and equipment model (PFEM) which represents the mapping between process functions and corresponding equipments. The process FMEA performance method using PFEM is a methodology that enables them to be found by systematically accessing failure modes, effects, and causes by using a combined VOC and defect history. Such a method may be useful for the equipment focused manufacturing processes like chemical plants. An actual case study is also given.
배진아 ( Jina A Bae ),차봉환 ( Bong Hwan Cha ),김기영 ( Ki Young Kim ),장중순 ( Joong Soon Jang ) 대한설비관리학회 2013 대한설비관리학회지 Vol.18 No.3
Solders are vitally used in SMT (surface mounting technology) processes of electronics manufacturing. Because of environmental issues, however, regulation like RoHS has been imposed on solders. This paper is to perform environmental effect assessment for the solder using E-FMEA (environmental- failure mode and effect analysis). To this end, solders and processes using them are identified and classified into activities, and then their potential environmental effect modes, causes/mechanisms, and environmental effects are estimated. Those derived modes and effects are assessed based on controlling documents (S), public image (I), environmental consequences (O) and improvement possibility. Improvement action plans are established for those 4 critical items that may affect environment seriously.