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장우순(Woosoon Jang),이백우(Baik-Woo Lee),김동원(Dong-Won Kim),권동일(Dongil Kwon) 대한기계학회 2001 대한기계학회 춘추학술대회 Vol.2001 No.8
In this study, we measure the thermal deformation of flip-chip solder joint by ESPI (Electronic Speckle Pattern Interferometry) system that has some advantages such as non-contact, non-destructive, real-time and full-field measurement. The ESPI system has been applied to bulk materials, but we try to apply it to micro material such as flip-chip package by improving its resolution with long working-distance microscope, zoom lens and iris. The sub-micrometer scale thermal deformation of flip-chip solder joint is measured from 25℃ to 125℃. Local shear strain in solder ball is also calculated from the measured thermal displacement. In addition, the experimental result from ESPI is compared with the predicted result from FEA(Finite Element Analysis). It is shown that shear strain from the experiment are similar to the predicted result from FEA.