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이홍기(Hong-Kee Lee),허진영(Jin-Young Hur) 한국표면공학회 2005 한국표면공학회지 Vol.38 No.6
Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, ITS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part. These can tested each and synthetically divide. This research is reliability evaluation for three kind of pb-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.
복합 착화제 첨가가 무전해 Ni-P 도금액의 특성에 미치는 영향
이홍기(Hong-Kee Lee),이호년(Ho-Nyun Lee),전준미(Jun-Mi Jeon),허진영(Jin-Young Hur) 한국표면공학회 2010 한국표면공학회지 Vol.43 No.2
In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.
무전해도금법으로 형성한 Ni-P-SiC 복합도금막의 특성
이홍기(Hong-Kee Lee),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.2
Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution, and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at 300℃ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.1
Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached 40 N/㎟ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.
SiC 나노입자를 이용하여 형성한 Ni-SiC 복합도금막의 미세구조 및 특성
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),전준미(Jun-Mi Jeon) 한국표면공학회 2007 한국표면공학회지 Vol.40 No.2
Ni-SiC composite coating layers were formed using two kinds of SiC nano-particles by DC electrodeposition in a nickel sulfamate bath containing SiC particles. The effect of stirring rate and SiC particle type on the microstructure and properties of Ni-SiC composite coating layers were investigated. Results revealed that the trend of deposition rate is closely related to the codeposition of SiC and the deposition rate of nickel, and the codeposition behavior of SiC can be explained by using hydrodynamic effect due to stirring. The average roughness and friction coefficient are closely related to the codeposition of SiC and SiC particle size. It was found that the Vickers microhardness of the composite coating layers increased with increasing codeposition of SiC. The composite coating layers containing smaller SiC particle showed higher hardness. This can be explained by using the strengthening mechanism resulting from dispersion hardening. Anti-wear property of the composite coating layers formed using 130 ㎚-sized SiC nano-particles has been improved by 2,300% compared with pure electroplated-nickel layer.
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),이호영(Ho-Young Lee),구석본(Seok-Bon Koo),전준미(Jun-Mi Jeon) 한국표면공학회 2006 한국표면공학회지 Vol.39 No.4
Ni-SiC composite coating layers were prepared by electroplating method and their deposition rate, codepo-sition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. It was found that the deposition rate and the codeposition of SiC in the composite coating layer increased with increasing concentration of SiC in the solution only at the early stage. Both of them reached certain maxima and then decreased with increasing concentration of SiC. Rough surface was obtained with increasing codeposition of SiC, which is probably due to the agglomeration of the SiC particle in the vicinity of surface. Vickers hardness increased with increasing codeposition of SiC and heat treatment at 300℃ in air for 1 hour. Wear volume decreased with increasing codeposition of SiC and friction coefficient increased with increasing codeposition of SiC at the early stage, and it became almost constant. Such wear and friction behaviors are desirable for the practical application.
메타버스 내에서 생성된 영업비밀의 법적문제 비밀관리성 요건을 중심으로
이홍기(Lee, Hong Kee) 성균관대학교 법학연구원 2021 성균관법학 Vol.33 No.4
메타버스 기술의 발전에 따라 메타버스에서 현실과 유사하거나 동일한 수준의 생산적인 활동을 영위할 수 있게 될 전망이다. 메타버스가 일상적인 기업의 업무 공간으로 활용될 경우, 메타버스 내에서 생성되는 영업비밀의 보호 문제가 제기된다. 이글은 현실세계와 다른 성질을 갖는 메타버스에 대하여 종래 영업비밀 요건 중 특히 비밀관리성 요건을 어떻게 적용할 것인지에 관해 검토하였다. 최소한 현실과 완전히 동일한 수준의 메타버스가 구현되지 않는 한, 비밀관리성 요건의 적용은 이미 존재하는 법리를 개별 메타버스의 특성에 따라 적용하는 것으로 충분하다고 파악된다. 그럼에도 불구하고 메타버스 환경이 더욱 도입됨에 따라 메타버스에서의 새로운 영업비밀 문제가 계속해서 제기될 것이다. 이 글은 대안으로서 메타버스를 활용하는 기업에 대한 영업비밀보호지침을 정책적으로 제시하여 가까운 미래에 발생할 실무적 문제를 예방할 것을 제안하였다. Recent metaverse technology will be able to engage in productive activities similar or equal to reality. If the metaverse is used as a business workspace, the protection of trade secrets within the metaverse arises. This article examines how to apply the trade secret requirements to the metaverse, which has a different nature than the real world. Unless the metaverse substitutes the real-world business space, it is understood that existing trade secret principles are still sufficient to apply. However, as long as the metaverse technology keeps developing, new trade secret issues will arise continuously. This article suggests providing the guidelines for protecting trade secrets in metaverse for practical issues in the near future.
무전해 니켈 도금용액에 사용되는 안정제의 도금피막 특성에 미치는 영향
이홍기(Hong-Kee Lee),손성호(Seong-Ho Son),전준미(Jun-Mi Jeon),구석본(Suck-Bon Koo),허진영(Jin-Young Hur) 한국표면공학회 2004 한국표면공학회지 Vol.37 No.6
Bath stabilizers in the electroless nickel(EN) plating solution are known to prevent sudden bath decomposition and extend its lifetime. Further, every stabilizer has a different role and function in EN solution and it influences the surface structure. In this study, the effects of various stabilizers on the deposition rate, surface morphology, deposition content of phosphor and hardness were investigated.