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정전류 방법을 이용하여 구리 전해도금 시 첨가제와 전류밀도 효과
우태규 ( Tae Gyu Woo ),설경원 ( Kyeong Won Seol ),이현우 ( Hyun Woo Lee ),박일송 ( Il Song Park ),윤영민 ( Young Min Yoon ),윤정모 ( Jeong Mo Yoon ),우경녕 ( Kyeong Nyong Woo ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 대한금속·재료학회지 Vol.44 No.8
The purpose of this study is to identify the effect of additives and current density on initial copper nucleation and growth during copper electrodeposition. Additives such as chloride ions, arabic gum were used in this study. An EG&G PAR model 273A potentiostat/galvanostat connected to a microcomputer with the M270 software was used for the electrochemical tests. Electrochemical experiments allied to SEM and image analysis were performed to characterize the nucleation and growth of copper in the presence of additives. In the higher current density, the copper foil had more uniform crystal size, higher surface covering and less needles shape crystals compared to lower current density. In the production of electrodeposited copper foil, grain size of the copper foil can be controlled by adding appropriate combination of additives.