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직교류형 열교환기에 대한 엘리멘트를 이용한 열정산 방법에 관한 연구
정형호,신흥태,김광호,이춘식,Jung, H.H.,Shin, H.T.,Kim, K.H.,Lee, C.S. 대한설비공학회 1991 설비공학 논문집 Vol.3 No.2
A thermal analysis method taking into account energy balance in each elements of heat exchanger was introduced. This method has a merit in predicting the temperature field over the heat exchanger in detail. To verify this method, the results were compared with the published ones. The thermal analysis of the radiator in vehicles was also conducted and the results were compared with experimental ones. It is concluded that this method can be used in thermal analysis with relatively small error. When the velocity profile of inlet air is not uniform, the outlet temperature of cooling water is higher than that of uniform velocity profile.
Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정
배귀남,박승오,이춘식,명현국,신흥태,Bae, G.N.,Park, S.O.,Lee, C.S.,Myong, H.K.,Shin, H.T. 대한설비공학회 1993 설비공학 논문집 Vol.5 No.2
Average particle deposition velocity toward a horizontal semiconductor wafer in vertical airflow is measured by a wafer surface scanner(PMS SAS-3600). Use of wafer surface scanner requires very short exposure time normally ranging from 10 to 30 minutes, and hence makes repetition of experiment much easier. Polystyrene latex (PSL) spheres of diameter between 0.2 and $1.0{\mu}m$ are used. The present range of particle sizes is very important in controlling particle deposition on a wafer surface in industrial applications. For the present experiment, convection, diffusion, and sedimentation comprise important agents for deposition mechanisms. To investigate confidence interval of experimental data, mean and standard deviation of average deposition velocities are obtained from more than ten data set for each PSL sphere size. It is found that the distribution of mean of average deposition velocities from the measurement agrees well with the predictions of Liu and Ahn(1987) and Emi et al.(1989).