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신지호(Ziho Shin),오명훈(Myeong-Hoon Oh),권혁제(Hyukje Kwon),김학영(Hag-Young Kim),강동재(Dongjae Kang) 대한전자공학회 2017 대한전자공학회 학술대회 Vol.2017 No.6
The cloud computing became new normal in the sphere of computing infra-structure. A Microserver, which has low-power, high-density and scale-out computing characteristic, is introduced as a novel approach of future cloud server system. This new server system configured multiple computing resources and, thus, a cloud computing operating system (OS) among the computing node is needed. In this paper, we installed the OpenStack (Mitaka) which is famous in the field of cloud OS, with multi-node configuration on the Microserver system to utilize the high-density computing resources efficiently. Further, evaluation of its performance according to the numbers of running computing nodes is delivered.
마이크로서버용 SRIO 패브릭 연결망을 위한 성능비교 환경 구축
신지호(Ziho Shin),오명훈(Myeong-Hoon Oh),권혁제(Hyukje Kwon),김학영(Hag-Young Kim),김영우(Young Woo Kim) 대한전자공학회 2016 대한전자공학회 학술대회 Vol.2016 No.6
A Microserver, which has high-density computing resources and low-power features, is known as one of promising technologies of future server systems. However, due to the lack of high-speed and reliable fabric interconnection among the computing resources, it can cause performance degradation on the entire system. A Serial RapidIO (SRIO) has been introduced as a feasible solution for implementing high speed fabric interconnection in the microserver system. Nonetheless, even the SRIO has much more benefits than other interconnection methodologies, it is hard to evaluate the real performance using SRIO in a user level. Hence, in this paper, we suggest performance evaluation environment for the SRIO versus ethernet based networking in both hardware and software side.
마이크로서버용 고속 패브릭 연결망을 위한 SRIO 브리지 통신 구현
오명훈(Myeong-Hoon Oh),신지호(Ziho Shin),권혁제(Hyukje Kwon),김영우(Young Woo Kim),권원옥(Won-Ok Kwon),김학영(Hag-Young Kim) 대한전자공학회 2015 대한전자공학회 학술대회 Vol.2015 No.11
In the era of cloud computing, various server systems have been introduced. A microserver, which has low-power and high-density characteristics, is known to be a novel approach of future server systems. The microserver can include multiple computing resources and, hence, a high-speed and reliable fabric interconnection among the computing resources is highly required in order to utilize those resources. In this paper, for the implementation of the fabric interconnection mentioned above, Serial RapidIO is introduced. We also address the end-point network environment and suggest the test result for feasibility on Linux operating system.
KOSMOS 마이크로 서버 고속 연결 망 제작과 IO 성능
권혁제(Hyukje Kwon),오명훈(Myeong-Hoon Oh),신지호(Ziho Shin),권원옥(Won-ok Kwon),김학영(Hag-Young Kim),강동재(Dongjae Kang) 대한전자공학회 2017 대한전자공학회 학술대회 Vol.2017 No.6
In this paper, we described the system interconnection topology of KOSMOS micro-sever and its hardware design configuration. The topology configured in KOSMOS micro-server was a folded hyper-cube with RapidIO Gen 2.1 x4 5Gbps per link One interconnection board connected to two compute boards on 4 CPUs each. We got 13.2Gbps@4MB(max)throughput and 2594us@4MB (min)latency of DMA, 3.5Gpbs@4KB (max), 227us@4KB(min) of message independing on the hop count.
권혁제(Hyukje Kwon),오명훈(Myeong-Hoon Oh),신지호(Ziho Shin),김학영(Hag-Young Kim),김영우(Young-Woo Kim) 대한전자공학회 2016 대한전자공학회 학술대회 Vol.2016 No.11
In this paper, we described modules that can be configured 256Gbs bandwidth at minimum as an interconnection on a micro-server. In this module, we used the SRIO on networking to get the merit which is a flexibility in configuring the networks. Micro-server was configured with sixteen compute cards, each card was composed with 4 CPU. The interconnection module connected to two compute cards. Each CPU supports PCIe gen1 2.5Gbps, 1x at minimum.
마이크로 서버용 연결망 모듈의 PCIe 디바이스 인터페이스 구성과 테스트
권혁제(Hyukje Kwon),오명훈(Myeong-Hoon Oh),신지호(Ziho Shin),김학영(Hag-Young Kim),김영우(Young-Woo Kim) 대한전자공학회 2016 대한전자공학회 학술대회 Vol.2016 No.6
This paper described the test method and interface of an interconnection module to interconnect Micro-server’s system interconnection that composed of PCIe-to-RapidIO bridges. RapidIO was selected for the flexibility of making a system network. Many processors have PCIe interface but they didn’t have RapidIO as an external IO. Therefore, we used a PCIe-to-RapidIO bridge to compose the interconnection network. The bridge that has x4 lane width was composed into x16 PCIe all together. And we designed some interface modules to independently test the bridge each.