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미세 전극 패턴을 갖는 알루미나 정전척을 이용한 LED용 사파이어 기판 흡착 연구
김형주(Hyung-Ju Kim),신용건(Yong-Gun Shin),안호갑(Ho-Kap Ahn),김동원(Dong-Won Kim) 한국표면공학회 2011 한국표면공학회지 Vol.44 No.4
In this work, handling of sapphire substrate for LED by using an electrostatic chuck was studied. The electrostatic chuck consisted of alumina dielectric, which was doped with 1.2 wt% TiO₂. As the volume resistivity of alumina dielectric was decreased, the electrostatic force was increased by Johnsen-Rahbek effect. The narrower width and gap size of electrode led to the stronger electrostatic force. When alumina dielectric with 3.20×10¹¹Ωㆍ㎝ resistivity and 3 ㎜ width/1.5 ㎜ gap sized electrode was used, the strongest electrostatic force in this work was obtained, which value reached to ~14.46 gf/㎠ at 2.5 ㎸ for 4-inch sapphire substrate. This results show that alumina electrostatic chuck with low resistivity and fine electrode pattern is suitable for handling of sapphire substrate for LED.