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- 저자 : 송병석(Byeongsuk Song) (검색결과 3 건)
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한창운(Changwoon Han),황순미(Soon-mi Hwang),송병석(Byeongsuk Song) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.10
The reliability of two differently-designed BLDC motors are investigated and compared to choose one of them for the fan application in a home appliance. A series of reliability tests are conducted to the BLDC motors including high temperature storage, low temperature storage, temperature cycling, humidity test, vibration test, drop test, and electrostatic discharge (ESD) test according to IEC 61000-4-2. Both of the BLDC motors don’t show any significant degradation of their characteristics after tests except ESD test. After ESD test, one type of motors shows 100% immunity but another type of motor shows 35% of failure. To investigate the cause of the failure in ESD test, a commercial ESD simulation program is used in modeling the two types of motors in electric overstress environment. Simulation results explain the vulnerable design for ESD in a BLDC motor and suggest that the design of controlling module in BLDC motor affects significantly ESD immunity.
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한창운(Changwoon Han),박노창(Nohchang Park),오철민(Chulmin Oh),홍원식(Wonsik Hong),송병석(Byeongsuk Song) 대한기계학회 2009 대한기계학회 춘추학술대회 Vol.2009 No.5
Heat sink system for a main board in a network computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. Constant high temperature condition in the computer keeps solder creeping and makes it failed eventually. To calculate the stress and predict the life of soldered anchor in the station, FE model is used. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. Creep tests are conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Calibrated Anand model represents the creep characteristics of SnPb solder accurately and, as a result, can perform life prediction of the solder precisely in creep condition.
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한창운(Changwoon Han),박노창(Nohchang Park),오철민(Chulmin Oh),홍원식(Wonsik Hong),송병석(Byeongsuk Song) 대한기계학회 2010 大韓機械學會論文集A Vol.34 No.1
본 논문에서는 네트워크 서버용 컴퓨터 주기판 내 장착된 열방열 시스템 지지구조물에 대한 유한요소 모델의 솔더 크리프 특성을 검증하였다. 열방열 시스템은 앵커 구조물로 지지되며 앵커 구조물은 솔더를 이용하여 인쇄회로기판에 장착된다. 컴퓨터 내 발생하는 지속적인 고온환경 하에서 솔더의 크리핑이 발생하고 이는 궁극적으로 지지구조물의 파괴로 이어진다. 유한요소모델은 솔더에 발생하는 응력분석과 수명예측을 위해 사용되며, 솔더 크리프 특성을 모사하기 위하여 Anand 크리프 모델을 적용하였다. 모델을 검증하고 교정하기 위하여 크리프 시험을 수행하였다. 시험은 인쇄회로기판의 변형을 제외한 솔더 변형만을 측정하기 위하여 특별한 지그를 설계하여 수행하였다. 크리프 시험결과를 유한요소해석결과와 비교하여 Anand 크리프 모델을 검증하고 교정을 수행하였다. 교정된 유한요소모델을 이용하여 열방열 시스템 구조물의 보다 정확한 수명 예측을 수행할 수 있다. The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model’s constants. Precise life prediction of soldered anchor in creep condition can be performed by this model
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