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경화속도에 따른 LED encapsulation silicone 탄성 및 점탄성 warpage
송민재(M. J. Song),김흥규(H. K. Kim),윤길상(G S. Yoon),김권희(K. H. Kim) 한국소성가공학회 2011 한국소성가공학회 학술대회 논문집 Vol.2011 No.5
The effect of cure reaction rate on the warpage of silicone resin for LED encapsulation was examined by using FEM based on elastic as well as viscoelastic material model. A square plate-shaped specimen was assumed for analysis. Two different conditions of cure reaction rates, i.e a fast isothermal curing and a slow heat-up curing, were assumed for FEM. The FEM predictions were compared with the actual specimens from a curing experiment. The FEM predictions showed that the amount of warpage was larger in the fast isothermal curing process than the slow heat-up curing process. The increased warpage in case of the fast curing was supposed to be caused by the higher reaction heat and the accompanying increase of thermal expansion difference between silicone resin and lead frame. The FEM prediction of cooling process was obtained by using both elastic and viscoelastic material models. In comparison with the experiment, total warpage from the viscoelastic model was more similar to the experimental measurement than the elastic model.
LED encapsulation 실리콘의 기포잔류방지를 위한 step 경화공정 연구
송민재(M.J.Song),김흥규(H.K.Kim),윤길상(G.S.Yoon),김권희(K.H.Kim) 한국소성가공학회 2011 금형가공 심포지엄 Vol.2011 No.9
Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in a cured resin product such as warpage, residual bubbles, and decreasing wetablility. In order to prevent residual bubbles in a silicone resin, step cure process was examined in the present paper. Three kinds of step cure processes were applied and bubble free phenomenon was observed experimentally. Experimental results showed that most of bubbles were removed under 70˚C which is the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature for providing DOC of less than 0.5~0.6 is an effective way to reduce residual bubbles and stress.
송민재 ( Min-jae Song ),신동혁 ( Dong-hyeok Shin ),최승식 ( Seung-sik Choi ),박성만 ( Sung-man Park ) 한국정보처리학회 2016 한국정보처리학회 학술대회논문집 Vol.23 No.1
본 논문에서는 사물인터넷 기반의 홈/사무실을 구현하기 위해 기존 디지털 도어락에 저전력 통신이 가능한 BLE 모듈을 탑재하고 가상 오브젝트 기반의 게이트웨이를 통하여 스마트폰으로 제어가 가능한 저전력 지능형 도어락 시스템을 개발함을 목표로 한다. 이 시스템은 사물인터넷 기술을 이용하여 기존의 도어락에 BLE 모듈을 부착하여 라즈베리파이와 서로 저전력 통신이 가능하게 한다. 부가적으로 스마트폰 애플리케이션을 사용하여 원격제어가 가능한 기능도 수행할 수 있다. [1]따라서, 사물인터넷 기반 저전력 디지털 도어락은 일반 가정집 도어락은 물론, 높은 보안을 필요로 하는 장소에까지 다양한 분야에서 효과적이고 편리하게 활용될 수 있을 것이다.