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온도변화에 따른 MEMS 자이로스코프 패키지의 변형측정
주진원(Jin-Won Joo),최용서(Yong-seo Choi),좌성훈(Sung-Hoon Choa),송기무(C. M. Song) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.11
In MEMS devices, packaging induced stress or stress induced structure deformation become<br/> increasing concerns since it directly affects the performance of the device. In this paper, deformation<br/> behavior of MEMS gyroscope package subjected to temparature change is investigated using<br/> high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and<br/> analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/<br/> contractions of the package are presented. Linear elastic behavior is documented in the temperature<br/> region of room temperature to 125℃. Analysis of the package reveals that global bending occurs due<br/> to the mismatch of thermal expansion coefficient between the chip, the molding compond and the<br/> PCB.