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MMIC에 적용되는 MIM 커패시터의 실리콘 질화막 증착과 전기적 특성
성호근,소순진,박춘배 한국전기전자재료학회 2004 전기전자재료학회논문지 Vol.17 No.3
We have fabricated MIM capacitors for MMIC applications, with capacitances as high as 600pF/$\textrm{mm}^2$ and excellent electrical properties of the insulator layer. Silicon nitride thin film is the desirable material for MMIC capacitor fabrication. Standard MIM capacitance in MMIC is 300pF/$\textrm{mm}^2$ with an insulator layer thickness of more than 2000$\AA$. However, capacitors with thin insulator layers have breakdown voltages as low as 20V. We have deposited insulator layers by PECVD in our MIM structure with an air bridge between the top metal and the contact pad. The PECVD process was optimized for fabricating the desired capacitors to be used in MMIC. Silicon nitride(Si$_{x}$N$_{y}$) thin films of about 1000$\AA$ thick show capacitances of about 600pF/$\textrm{mm}^2$, and breakdown voltages above 70V at 100nA.A.A.
고전압 β-산화갈륨(β-Ga2O3) 전력 MOSFETs
문재경,조규준,장우진,이형석,배성범,김정진,성호근 한국전기전자재료학회 2019 전기전자재료학회논문지 Vol.32 No.3
This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide (Ga2O3) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating β-Ga2O3 (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of 10×15 mm2. Although we fabricated several types of power devices using the same process, we only report the characterization ofa finger-type MOSFET with a gate length (Lg) of 2 μm and a gate-drain spacing (Lgd) of 5 μm. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for Vgs<-6 V, and the three-terminal off-state breakdown voltage was over 482 V in a Lgd=5 μm device measured in Fluorinert ambient at Vgs=-10 V. A low drain leakage current of 4.7 nA at the off-state led to a high on/offdrain current ratio of approximately 5.3×105. These device characteristics indicate the promising potential of Ga2O3-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry. 본 논문에서는 국내 최초로 항복전압 480 V 이상을 갖는 산화갈륨 MOSFETs을 시연하였다. Si-도핑된 β-Ga2O3 채널층은 Fe-도핑된 β-Ga2O3 (010) 기판위에 분자선 증착법 (MBE)으로 성장되었다. 게이트 길이 (Lg) 2 µm, 게이트-드레인 간격 (Lgd) 5 µm 소자의 경우 핀치오프 전압(Vp) 이 -6.1 V, 게이트 전압 (Vgs) -10 V 에서 항복전압이 -482 V, 드레인 누설전류 4.7 nA, 온/오프 전류비는 5.3x105으로 평가되었다. 이러한 소자의 특성은 산화갈륨 전자소자가 전기자율주행차, 철도, 태양광 및 신재생 에너지 및 산업과 같은 차세대 고전력 소자응용에 응용이 유망할 것으로 생각된다.
고전압 β-산화갈륨(β-Ga<sub>2</sub>O<sub>3</sub>) 전력 MOSFETs
문재경,조규준,장우진,이형석,배성범,김정진,성호근,Mun, Jae-Kyoung,Cho, Kyujun,Chang, Woojin,Lee, Hyungseok,Bae, Sungbum,Kim, Jeongjin,Sung, Hokun 한국전기전자재료학회 2019 전기전자재료학회논문지 Vol.32 No.3
This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.