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레이저 간섭계 ( ESPI ) 를 이용한 폴립칩 패키지의 열변형 평가
장우순(Woo Soon Jang),이백우(Baik Woo Lee),김동원(Dong Won Kim),정증현(Jeung Hyun Jeong),백경욱(Kyung Wook Paik),권동일(Dong Il Kwon),나전웅(Jae Woong Nah) 대한금속재료학회 ( 구 대한금속학회 ) 2002 대한금속·재료학회지 Vol.40 No.9
In this study, electronic speckle pattern interferometry (ESPI) was applied to a non-destructive and real-time evaluation of the thermal deformation in a flip-chip package. The displacement resolution of ESPI was improved with magnifying lenses, and ESPI was modified to measure the deformation of micro systems. The flip-chip package thermally deforms with increasing temperature, and the difference in the thermal expansion between the chip and the PCB induces the micro-failure at the solder joint. To evaluate the level of thermal deformation precisely, the horizontal and vertical deformations were measured in the temperature range of 25℃ to 125℃ in situ using the resolution-enhanced ESPI to a sub-micrometer scale. From the experimental results, it was found that the CTE (coefficient of thermal expansion) difference between the chip and the PCB leads to shear strain at the solder joint. In addition, the shear strain could be evaluated at each solder joint. To verify these experimental results, the finite element analysis(FEA) results were compared with the ESPI results. The FEA results were similar to the ESPI results, which confirmed the adequacy of our application.