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- 저자 : 김흥배(Hung Bai Kim) (검색결과 1 건)
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김광수(Kwang Soo Kim),김동권(Dong Kwon Kim),원명희(Myong Hee Won),김흥배(Hung Bai Kim) 대한기계학회 2001 대한기계학회 춘추학술대회 Vol.2001 No.3
Rapid development of Telecommunication Technology requires small size, high density packaging and high power of Electronic devices. And the environment of those devices is very severe. These rapid developments of technology induced high density heat dissipation of devices. Dust and moisture can do harm severely to outdoor Telecommunication Equipment, so those should be separated completely from environments. In these special structures, present cooling technology cannot satisfy the thermal problem. For the very high thermal conductivity, heat pipe can transfer heat from interior of cabinet to outdoor. So cool ing module with heat pipe can be new solution to these thermal problems. Cooling module with heat pipe can solve the cabinet sealing problem and get satisfactory result without extra cooling unit, e.g air conditioner. And cooling module with heat pipe is simple structure and can be made in small size, so user can treat it easily Local high temperature by high density heat dissipation also can decrease using cooling module with heat pipe. In this paper, we tested cooling module composed of heat pipe and fins. Heat pipes is 12.7 ㎜ diameter with woven-wired wick. We tested to satisfy 810W power dissipation LPA device in two ways and submit the results, one is experiment and the other is computational method using ICEPAK code.
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