http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
플라스틱 솔더볼의 열응력 해석을 통한 최적 솔더볼 설계 기술
김환동(H.-D. Kim),윤도영(D.-Y. Yoon),황진우(J.-W. Hwang) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-
Recently, Pb-free solder ball technology, which is getting more significant in miniaturization of electronic equipment, and resolution of recent environmental problems, is necessary to be developed. A plastic-core solder ball is much promising in those considerations. Plastic-core solder balls have the tendency to replace the usual metal-core solder ball from low material cost and superior mechanical properties. The thermal effects, however, are important in manufacturing process, such as deposing nano-sized metal thin film on the spherical polymer surface. Furthermore plastic-core solder balls are easy to be broken due to CTE and elastic coefficient of material property from heat transfer. We propose technical computational investigations for the manufacturing design and the reliability of plastic-core solder ball from thermal stress analysis.