The Study of Filler Effect in Semiconductor Encapsulation Molding Compound Including Multifunctional Epoxy Resin

김환건 서경대학교 산업기술연구소 1997 産業技術硏究所論文集 Vol.2 No.-

The change of physical properties of epoxy molding compound(EMC) for semiconductor encapsualtion materials including multifunctional epoxy resin is investigated accoridng to the filler change. The flexurul strength and modulus of EMC increases with the content of silica, As the mixing weight ratio of spherical type fused silica increases, the flowability of EMC improves, however, the moldability such as resin bleed is not hardly influenced. The mechanical properties, the flexural strength and modulus, shows saturntion curve properties according to the increase of spherical type silica content, The optimum mixing weight ratio of spherical type silica can be obtained on these experiments, that is about the region between 60 - 70 wt% in this case.

이형제 변화에 따른 반도체용 에폭시 수지 성형재료의 흡습특성

김환건 서경대학교 산업기술연구소 2001 産業技術硏究所論文集 Vol.10 No.-

The properties of moisture absorption in epoxy molding compound(EMC) for semiconductor encapsulation according to the change of releasing agent content were investigated. A maximum content of moisture absorption was measured under 121℃, 2atm, and 100% relative humidity conditions using pressure cooker test(PCT), and the changes of moisture content with time were peformed under the conditions of 85℃ and 85% relative humidity. The diffusion coefficients in EMC according the changes of releasing agent content were calculated in terms of modified Crank equation based on Ficks` law, so that these data could be interpreted in respect of water absorption mechanism in plastic package model for semiconductor.

새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구

김환건 한국반도체디스플레이기술학회 2017 반도체디스플레이기술학회지 Vol.16 No.2

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

The Change of Physical Properties of Epoxy molding Compound According to the Change of Silica Content

김환건 서경대학교 산업기술연구소 1996 産業技術硏究所論文集 Vol.1 No.-

The physical properties of epoxy molding compound(EMC) according to the change of silica content as filler have been investigated in order to study the relationship between the content of silica, which is main filler of EMC for semiconductor encapsulation, and EMC. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient and temperature of glass transition(Tg) as thermal properties, and spiral flow as mold ability have been investigated to see the change of physical properties of EMC. Flexural modulus of EMC increased with the silica content, and the minimum of flexural strength was observed in the region of 50% of silica content. The thermal expansion coefficients in the region below Tg(of) keep constant value according to the change of silica content. The minimum value of Tg was measured in the region of50% of silica content. It can be found out that spiral flow of EMC has the maximum value in the region of 50% of silica content, so mold ability has very good relationship with Tg. We have considered these system in respect of internal stress.

반도체 성형용 Epoxy 수지계에서의 polysiloxane 의 분산특성에 관한 연구 I : Epoxy 변성 Polysiloxane

김환건 서경대학교 산업기술연구소 1998 産業技術硏究所論文集 Vol.4 No.-

The dynamic mechanical thermal properties and dispersion properties of epoxy molding compound(EMC) according to the change of epoxy modified polysiloxane modifier grade and mixing temperature have been investigated using Dynamic Mechanical Thermal Analyser(DMTA) and several kinds of microscopes. The compatibilities between epoxy modified polysiloxane and epoxy resin system increase with mixing temperature and lower viscosity of modifier. The modulus of epoxy resin system decreases with the smaller domain size of modifier and the increase of compatibility between modifier and epoxy resin system, however, the modifier with the very low viscosity shows the good compatibilities, but should not represent lower modulus.

Biphenyl Epoxy 변성 광경화형 수지의 합성과 광경화 특성에 관한 연구 1

김환건 서경대학교 산업기술연구소 2006 産業技術硏究所論文集 Vol.17 No.-

A synthesis and photo-cure properties of biphenyl epoxy modified photo-polymer(YX-4000H/MA) were studied. A biphenyl moiety were introduced to methacrylate type photo-polymer systems in order to increase heat resistance and transparency of them. The double bond peak intensity changes of this photo-polymer were measured using FT-IR spectroscopy to obtain photo-cure conversion. Photo-cure properties of this photo-polymer according to the addition of DPHA as cross-linking agent were investigated. The photo-cure rate of YX-4000H/MA with DPHA is faster than that without DPHA. However, a cure conversion of this resin with DPHA shows lower conversion than that without DPHA. This photopolymer systems represent n-th order cure kinetics irrespective of addition of DPHA, and kinetic parameters of these systems can be obtained and summarized.

Chip Scale Package(CSP)용 액상 에폭시 수지 시스템의 흡습특성

김환건 서경대학교 산업기술연구소 2004 産業技術硏究所論文集 Vol.14 No.-

The change of diffusion coefficient and moisture content ratio according to the change of liquid type epoxy resin were investigated in this paper. The epoxy resins used in this study are RE-304S, RE310S, RE-810NM, and HP-4032D for Chip Scale Package(CSP) applications. Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The temperature of glass transition (Tg) was measured using Dynamic Scanning Calorimeter(DSC), and the moisture absorption properties of these epoxy resin systems according to the change of time were observed at 75℃ and 95% relative humidity condition. The diffusion coefficients in these epoxy resin systems were calculated in terms of modified Crank equation based on Ficks` law. A decrease of diffusion coefficient with increase of Tg in these systems can be observed, however, a increase of maximum moisture content ratio with Tg were measured. The lower moisture content ratio and higher diffusion coefficient of RE-810NM compared with other systems are contributed with allyl group of RE-810NM. The lower diffusion coefficient and higher moisture content ratio of HP-4032D can be attributed to the naphthalene moiety of HP-4032D.

촉매 혼합비 변화에 따른 Non-Post Cure Type EMC의 물성변화에 관한 연구

김환건 서경대학교 산업기술연구소 2003 産業技術硏究所論文集 Vol.13 No.-

The physical properties of epoxy molding compound (EMC) for semiconductor encapsulation according to the mixing ratio of catalyst were investigated. The catalyst contents, ash contents, wax content, epoxy resin and hardener grade were fixed. An equivalent ratio of epoxy and hardener, filler grade, and coupling agent content were changed with the mixing ratio change of catalyst in order to obtain main factor for physical properties. These data have been analysed using Taguchi`s method, so the remarkable changes for physical properties change according to the mixing ratio of the catalyst can be found in spiral flow as moldability and flexural modulus as mechanical property.

Photocure Reactions of Photoreactive Prepolymers with Cinnamate Groups

김환건 대한화학회 2011 Bulletin of the Korean Chemical Society Vol.32 No.3

The photoreactive prepolymers with multifunctional cinnamate and bisphenol Atype cinnamate groups that could perform photodimerization without photoinitiators were synthesized by the reaction of t-cinnamic acids (CAs) and epoxy resins. Their photocure reaction rates and the extent of reaction conversion were measured with Fourier transform infrared spectroscopy, and these increased with the intensity of UVirradiation. The experimental data of these reaction rates showed the characteristics of nth-order kinetics reaction, and all kinetic constants of each photoreactive polymer with this equation were summarized. Although the GTR-1800-HCA and KWG1-EP-HCA with hydroxyl group substituted cinnamate showed lower reaction conversion rates and rate constant than GTR-1800-CA and KWG1-EP-CAwith an unsubstituted cinnamate group, GTR-1800-MCAand KWG1-EP-MCAwith methoxy group substituted cinnamate showed similar and higher reaction conversion rates than the former, respectively. These results were explained in terms of segmental mobility for photopolymerization by molecular interactions.

중공형 구형 은입자의 함량변화에 따른 에폭시 수지조성물의 전도특성 연구

김환건,임륜우 한국반도체디스플레이기술학회 2012 반도체디스플레이기술학회지 Vol.11 No.2

The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.