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C-MEMS 기반 디바이스의 패키징을 위한 탄소 박막이 집적된 Through Silicon Via 기술 개발
곽종현(Jong-Hyun Kwak),김범상(Beomsang Kim),김신관(Shin-Kwan Kim),김건호(Gun-Ho Kim),신흥주(Heungjoo Shin) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
Through silicon via (TSV) is an important component in microelectromechanical systems (MEMS) packaging used for electrical connections through a silicon chip. A widely used approach in TSV fabrication is to fill the TSV holes with metals or electrically conductive adhesives. However, they are not compatible with MEMS devices that require high temperature (e.g. C-MEMS technology including high temperature pyrolysis processes) or harsh chemical processes. In this paper, we introduce a novel method of TSV technology compatible with C-MEMS process. By sealing the top side of TSV holes with an electrically conductive thin carbon film derived by the pyrolysis of photoresist, good electrical connection through TSVs (~ 10 Ω) was secured even after C-MEMS-based humidity integration via high temperature process (~ 700 ℃).
Thermally reduced graphene oxide (TRGO) 작동 유체의 열전달 특성에 관한 실험적 연구
김대욱(Dae-Wook Kim),김신관(Shin-Kwan Kim),김건호(Gun-Ho Kim) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
Rapid development of energy density electronic components has brought attention to high performance heat dissipation. The heat dissipation performance of liquid cooling system, which is typically desired for dense heat dissipation, is largely affected by working fluid within heat-exchanger and heatsink. There has been efforts of implementing working fluid to enhance of heat dissipation capability. In this work, we utilized low cost graphene oxide particles for working fluid, and further present its heat dissipation efficiency as a function of its concentration (0.001 to 0.05 wt%) and working fluid flow rate (0.3 to 2.0 LPM). The graphene oxide particles were prepared by single step thermal reduction process from biopolymer Shellac, called thermally reduced graphene oxide (TRGO). The TRGO working fluid of 0.005 wt% of TRGO prepared at 600 ˚C was found to show a heat transfer coefficient (h) greater by 45% at 0.3 LPM compared with pure water.