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분사냉각모듈 내에 부착된 히트싱크에 따른 고출력 LED의 냉각성능에 관한 연구
구건모(G. M. Ku),김경진(K. Kim),박상희(S. H. Park),최성대(S. D. Choi),허정욱(J. W. Heo) 한국기계가공학회 2013 한국기계가공학회지 Vol.12 No.6
The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.