http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
고현준(Hyun-Jun Ko),박균명(Gyun-Myoung Park),김옥래(Ok-Rae Kim),송춘삼(Chun-Sam Song),김준현(Joon-Hyun Kim),김종형(Jong-Hyeong Kim) 대한기계학회 2010 대한기계학회 춘추학술대회 Vol.2010 No.4
This paper aimed at the air-pad design of non-contact transfer for wafer. It is focused on precise control for minimization of pneumatic loss, prevention of wafer secession, and reduction of wafer shock during holding the wafer. Analysis are performed at design parameters of path length for hand device injection port, inlet air size, and central out let hole of air pad. The results are analyzed with effective air flow field including lifting force. It is seen that this system adopting the Bernoulli principle can be applied to non-contact transfer line through the capacity results of air pad design and negative pressure distribution by swirl creating flow field.