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회전하는 웨이퍼 위의 세정액 발달 및 분리 현상에 대한 시뮬레이션 해석
원종찬(Jongchan Won),원윤재(Yoonjae Won),윤현근(Hyeongeun Yun),이진욱(Jinwook Lee),이학선(Hakseon Lee),강성원(Seongown Kang) 대한기계학회 2021 대한기계학회 춘추학술대회 Vol.2021 No.11
We perform resolved simulations and examined development and break-up of cleaning liquid over a rotating wafer. The effects of the rpm, flow rate, jet angle, diameter, and contact angle are examined. The effects of cleaning liquid are examined in several ways including the coverage, wall shear stress, application time. Instantaneous flow fields show development of many small-sized liquid ligaments that are affected strongly by the contact angle. For a higher hydrophobicity, a smaller coverage value and faster film break-up are observed. It is shown that the coverage value is not related to the jet diameter and strongly related to the flow rate and rpm.