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Ta<sub>2</sub>O<sub>5</sub> 박막증착에서 플라즈마 전 처리를 통한 Polycarbonate와 Polyethersulphone 기판의 표면 개질
강삼묵,윤석규,정원석,윤대호,Kang, Sam-Mook,Yoon, Seok-Gyu,Jung, Won-Suk,Yoon, Dae-Ho 한국세라믹학회 2006 한국세라믹학회지 Vol.43 No.1
Surface of PC (Polycarbonate) and PES (Polyethersulphone) treated by plasma modification with rf power from 50 W to 200 W substrates in Ar (3 sccm), $O_2$ (12 sccm) atmosphere. From the results of modified substrates in XPS (X-ray Photoelectron Spectroscopy), the ratio of oxide containing bond increased with rf power. As the rf power was 200 W, the contact angle was the lowest value of 14.09 degree. And the datum from AFM (Atomic Force Microscopy), rms roughness value of PES and PC substrates increased with rf power. We could deposit $Ta_2O_5$ with good adhesion on plasma treated PES and PC substrates using by in-situ rf magnetron sputter.
Ta2O5 박막증착에서 플라즈마 전 처리를 통한 Polycarbonate와 Polyethersulphone 기판의 표면 개질
강삼묵,윤석규,윤대호,정원석 한국세라믹학회 2006 한국세라믹학회지 Vol.43 No.1
Surface of PC (Polycarbonate) and PES (Polyethersulphone) treated by plasma modification with rf power from 50 W to 200 W substrates in Ar (3 sccm), O2 (12 sccm) atmosphere. From the results of modified substrates in XPS (X-ray Photoelectron Spectroscopy), the ratio of oxide containing bond increased with rf power. As the rf power was 200 W, the contact angle was the lowest value of 14.09 degree. And the datum from AFM (Atomic force microscopy), rms roughness value of PES and PC substrates increased with rf power. We could deposit Ta2O5 with good adhesion on plasma treated PES and PC substrates using by in-situ rf magnetron sputter.
Fluorine 첨가에 의한 F-doped SiOC : H 박막의 저 굴절률 특성
윤석규,강삼묵,정원석,박우정,윤대호,Yoon, S.G.,Kang, S.M.,Jung, W.S.,Park, W.J.,Yoon, D.H. 한국결정성장학회 2007 韓國結晶成長學會誌 Vol.17 No.2
F-doped SiOC : H thin films with low refractive index were deposited on Si wafer and glass substrate by plasma enhanced chemical vapor deposition (PECVD) as a function of rf powers, substrate temperatures, gas rates and their composition flow ratios ($SiH_4,\;CF_4$ and $N_2O$). The refractive index of the F-doped SiOC : H film continuously decreased with increasing deposition temperature and rf power. As $N_2O$ gas flow rate decreased, the refractive index of the deposited films decreased down to 1.3778, reaching a minimum value at rf power of 180W and $100^{\circ}C$ without $N_2O$ gas. The fluorine content of F-doped SiOC : H film increased from 1.9 at% to 2.4 at% as the rf power was increased from 60 W to 180 W, which results in the decrease of refractive index. 저굴절 재료인 F-doped SiOC : H 박막을 Si 웨이퍼와 유리기판위에 rf power, 기판온도, 그리고 가스유량($SiH_4,\;CF_4$ and $N_2O$)을 변수로 하여 PECVD법으로 증착하였다. 기판 온도와 rf power증가에 따라 F-doped SiOC : H 박막의 굴절률은 감소하는 경향을 보였다. $N_2O$ 가스 유량이 감소함에 따라 증착된 박막의 굴절률은 감소하였으며, rf power가 180W 기판온도 $100^{\circ}C$, 그리고 $N_2O$ 가스를 첨가하지 않은 조건에서 증착한 박막은 최소 굴절률인 1.3778을 갖는 것을 알 수 있었다. Rf power 60W에서 180W로 증가시킴에 따라 증착된 박막의 불소 함량은 1.9at%에서 2.4at%로 증가하였으며 이러한 이유로 박막의 굴절률은 감소하는 경향을 나타냈다.
Source와 기판 거리에 따른 GaN nanowires의 합성 mode 변화 제어
신동익,이호준,강삼묵,윤대호,Shin, T.I.,Lee, H.J.,Kang, S.M.,Yoon, D.H. 한국결정성장학회 2008 韓國結晶成長學會誌 Vol.18 No.1
GaN nanowires는 수평 VPE법으로 합성 되었다. 본 실험에서는 source와 기판과의 거리가 합성된 GaN nanowires의 형상에 미치는 영향에 대하여 실험하였다. GaN nanowires는 $950^{\circ}C$ 온도에서 Ar 과 $NH_3$ 가스가 각각 1000, 50 sccm 의 유량에서 합성되었다. 합성된 GaN nanowires의 단면형태는 삼각형의 모양을 가졌으며, GaN nanowires의 길이는 200에서 500 nm 정도 였다. 합성된 GaN nanowires의 모양은 FESEM 으로 확인하였고, XRD 분석을 통하여 그 구조가 wurzite 구조인 것을 확인하였다. 또한, HRTEM 사진과 SAED 패턴을 통하여 합성된 GaN nanowires의 표면과 구조를 분석하였다. 성장된 GaN nanowires의 광학적 특성은 PL분석을 통하여 이루어졌다. We synthesized GaN nanowires with high quality using the vapor phase epitaxy technique. The GaN nanowires were obtained at a temperature of $950^{\circ}C$. The Ar and $NH_3$ flow rates were 1000 sccm and 50 sccm, respectively. The shape of the GaN nanowires was confirmed through FESEM analysis. We were able to conclude that the GaN nanowires synthesized via vapor-solid (VLS) mechanism when the source was closed to the substrate. On the other side, the VS mechanism changed to vapor-liquid-solid (VLS) as the source and the substrate became more distant. Therefore, we can suggest that the large amount of Ga source from initial growth interrupt the role of catalyst on the substrate.