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      • KCI등재

        Properties of a New Adhesive Composed of Gambir-Sucrose

        ( Tito Sucipto ),( Ragil Widyorini ),( Tibertius Agus Prayitno ),( Ganis Lukmandaru ) 한국목재공학회 2020 목재공학 Vol.48 No.3

        Gambir is a non-wood forest product with a potential of being used as wood adhesive, due to about 33% catechin in it. Meanwhile, catechins and sucrose have not been studied as adhesives. Therefore, basic characteristics of gambir-sucrose adhesives were investigated. In this research, adhesives were prepared by dissolving gambir and sucrose in distilled water, at different blending ratios of the gambir/sucrose such as 100/0, 75/25, 50/50, and 25/75 wt%. Furthermore, gas chromatography-mass spectrometry (GC-MS) was employed to determine the gambir chemical compositions, and Fourier transform-infrared (FTIR) spectroscopy was carried out to identify chemical bonds. Particleboards with a target density of 0.8 g/cm3 were then manufactured by hot-pressing for 10 min at 200℃. The internal bond (IB) strength of particleboard was subsequently measured. Based on the GC-MS analysis, 31.11% of catechin was identified. In addition, the viscosity, density, solid content, and gelation time of the adhesives, and insoluble matter content (IMC) in boiling water were 7.30~33.24 mPa.s, 1.2~1.3 g/cm3, 25.56~28.44%, 73~420 min, and 29.75~62.10%, respectively. Adding sucrose to the adhesive was observed to raise the IMC from 49.05 to 62.10%, at 180℃ and 200℃. FT-IR analysis showed that the gambir absorption peaks occurred at approximately 1620 cm-1, assigned to the C=O stretching of 5-hydroxymethylfurfural, which tended to increase with the addition of sucrose. The reaction between gambir and sucrose was observed in the form of the dimethylene ether bridge. The 25/75 wt% gambir-sucrose adhesives and 200℃ hot-pressed temperature resulted in the highest IB strength (0.89 MPa), and met the requirement of JIS A5908-2003 type 18. Consequently, the gambir-sucrose adhesive could be used as a particleboard adhesive.

      • [< 전시-P-66 >] The Effect of Spraying Adhesive Technique on Particleboard Properties

        ( Apri Heri Iswanto ),( Tito Sucipto ),( Irawati Azhar ),( Rudi Hartono ) 韓國木材工學會 2017 한국목재공학회 학술발표논문집 Vol.2017 No.1

        The objective of the research was to evaluate the effect of technical spraying adhesive on physical and mechanical particleboard using UF and Isocyanat mixture. UF/Isocyanat ratio used in this experiment was 70/30 (%w/w). There were five type of technical spraying for the treatments namely A (UF resin was applied in core resin and Isocyanat for surface resin), B (Isocyanat resin was applied as core resin and UF for surface resin), C (Isocyanat resin was sprayed in the first then followed by UF resin), D (UF resin was sprayed in the first then followed by Isocyanat resin), and the last E (UF and Isocyanat had mixed before spray). Boards produced with size of 25 by 25㎠, the density and board thickness target were 0.75gcm<sup>-3</sup> and 1cm respectively. Hot press was set in 140℃ temperature for 10 minutes and 30kgcm<sup>-2</sup> pressures. Seven days required for conditioning of board after pressing process. The results showed that board type of D resulted the best dimensional stability. It was described by the smallest value of thickness swelling and water absorption. For the mechanical properties parameters, board type of “B” resulted the best bending and internal bond properties. The present of Isocyanat in UF resin resulted in improvement of dimensional stability and mechanical properties of particleboard.

      • KCI등재

        Physical and Mechanical Properties of Three-layer Particleboards Bonded With UF and UMF Adhesives

        Apri Heri Iswanto,Janrahman Simarmata,Widya Fatriasari,Irawati Azhar,Tito Sucipto,Rudi Hartono 한국목재공학회 2017 목재공학 Vol.45 No.6

        A low dimensional stability and poor bending strength properties were main problems in particleboard manufacturing. The objective of this research was to evaluate the effect of mixed wood species and urea-form-aldehyde (UF) or urea-melamine-formaldehyde (UMF) resins on the physical and mechanical properties of three-layer particleboards. The ratio of face/core/back layer was 1 : 2 : 1. The resin content of 12% for both UF resins and UMF resins (UF/MF = 70/30% w/w) was used. The results of this study showed that the utilization of S.mahagony shaving using both UF and UMF resins caused a decrease in the thickness swelling and water absorption of the boards. Thickness swellings of particleboard made of Sengon/Sengon/Sengon (SSS), Mahogany/Mahogany/Mahogany (MMM), Sengon/Mahogany/Sengon (SMS), and Mahogany/Sengon/Mahogany (MSM) were in the range of 23%, 12∼16%, 14∼16%, and 13∼21%, respectively. The board bonded with UMF resin demonstrated better dimensional stability than that bonded with UF resin alone. Modulus of elasticity (MOE) and modulus of rupture (MOR) of particleboards made of S. mahagony shaving in the surface layer in both MMM and MSM boards were better than those of the SSS and SMS. MOE of MMM and MSM board was in the ranges of 24,000 to 26,000 kg.cm<sup>-2</sup> and 18,000 to 21,000 kg.cm<sup>-2</sup> respectively. Meanwhile, the MOR of board was in the ranges of 200 to 240 kg.cm<sup>-2</sup> and 190 to 228 kg.cm<sup>-2</sup>, respectively.

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