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The Physical, Mechanical, and Sound Absorption Properties of Sandwich Particleboard (SPb)
( Apri Heri Iswanto ),( Arif Rahman Hakim ),( Irawati Azhar ),( Basuki Wirjosentono ),( Dita Sari Prabuningrum ) 한국목재공학회 2020 목재공학 Vol.48 No.1
While the utilization of wood as a raw material in related industries has been increasing with the population increasing, the availability of wood from natural forests has continued to decline. An alternative to this situation is the manufacture of particleboard from non-wood lignocellulose materials through the modification of sandwich particleboard (SPb) using bamboo strands as reinforcement. In this study, strandsof belangke bamboo (Gigantochloa pruriens W) and tali bamboo (Gigantochloa apus) were utilized. The non-wood particles included sugar palm fibers, cornstalk, and sugarcane bagasse. The board was made in a three-layer composition of the face, back, and core in a ratio of 1: 2: 1. The binder used was 8% isocyanate resin. The sheet was pressed at a temperature of 160°C for 5 min under a pressure of 3.0 N/mm<sup>2</sup>. Testing included physical and mechanical properties based on the JIS A 5908 (2003) standard, while acoustic testing was based on ISO 11654 (1997) standards. The results showed that using bamboo strands as reinforcement has an effect on the mechanical and physical properties of SPb. Almost all the types of boards met the JIS A 5908 (2003) standards, with the exception of thickness swelling (TS) and internal bond (IB) parameters. Based on the thickness swelling parameter, the C-type board exhibited the best properties. Overall, the B-type board thatused a belangke bamboo strand for the surface and sugarcane bagasse as the core underwent the best treatment. Based on the acoustical parameter, boards using a tali bamboo strand for the surface and sugar palm fiber as the core (E-type board) exhibited good sound absorption properties.
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Effect of Several Exterior Adhesive Types on Dimensional Stability of Bamboo Oriented Particleboard
Iswanto, Apri Heri,Munthe, Rensus,Darwis, Atmawi,Azhar, Irawati,Susilowati, Arida,Prabuningrum, Dita Sari,Fatriasari, Widya Materials Research Society of Korea 2019 한국재료학회지 Vol.29 No.5
The objective of this research is to evaluate the effect of adhesive types on dimensional stability of bamboo-oriented particleboard. The materials used in this research are bamboo tali(Gigantochloa apus J.A & J.H. Schult. Kurz), UF/MDI(8, 10, 12 % level), and MF, MDI, and PF at 7 % level. Particle and adhesive are mixed using a blending machine; then, mat forming and hot pressing processes are performed using adhesive-suitable temperature and time references. MDI resin is set at $160^{\circ}C$ temperature for 5 minutes. PF resin and MF resin are pressed at $170^{\circ}C$ for 10 minutes, and $140^{\circ}C$ for 10 minutes, respectively, while UF/MDI sets at temperature of $140^{\circ}C$ for 10 minutes. The results show that particleboard using PF resin produces the lowest thickness swelling value. The particleboard using UF/MDI resin also produces good response for thickness swelling value. Interesting things happen in that UF/MDI adhesive produces a thickness swelling value better than that of MDI resin. FTIR analysis on particleboard bonded by UF/MDI resin combination shows the presence of carbonyl group C=O vibration on multi substitution of urea at wave number of around $1,700cm^{-1}$.
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