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Engineered Extracellular Vesicles as a Targeted Delivery Platform for Precision Therapy
Sun Yuntong,Sun Fengtian,Xu Wenrong,Qian Hui 한국조직공학과 재생의학회 2023 조직공학과 재생의학 Vol.20 No.2
Extracellular vesicles (EVs)-based cell-free strategy has shown therapeutic potential in tissue regeneration. Due to their important roles in intercellular communications and their natural ability to shield cargos from degradation, EVs are also emerged as novel delivery vehicles for various bioactive molecules and drugs. Accumulating studies have revealed that EVs can be modified to enhance their efficacy and specificity for the treatment of many diseases. Engineered EVs are poised as the next generation of targeted delivery platform in the field of precision therapy. In this review, the unique properties of EVs are overviewed in terms of their biogenesis, contents, surface features and biological functions, and the recent advances in the strategies of engineered EVs construction are summarized. Additionally, we also discuss the potential applications of engineered EVs in targeted therapy of cancer and damaged tissues, and evaluate the opportunities and challenges for translating them into clinical practice.
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Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces
Menglong Sun,Zhangjian Zhao,Fengtian Hu,Anmin Hu,Ming Li,Huiqin Ling,Tao Hang 대한금속·재료학회 2018 ELECTRONIC MATERIALS LETTERS Vol.14 No.4
The effects of Sn layer orientation on the evolution of Cu/Sn joint interfaces were investigated. Three Sn layers possessing(112), (321) and (420) orientations were electroplated on polycrystalline Cu substrates respectively. The orientations of Snlayer preserved during reflowing at 250 °C for 10 s. After aging at 150 °C for different time, the interfacial microstructureswere observed from the cross-section and top-view. The alignment between the c-axis of Sn and Cu diffusion direction significantlysped up the Cu diffusion, leading to the thickest intermetallic compound layer formed in (112) joint. Two types ofvoids, namely, intracrystalline voids and grain islanding caused intercrystalline voids generated at Cu/Cu3Sn interfaces dueto the different interdiffusion coefficients of Cu and Sn (112) oriented Sn/Cu joint produced many more voids than (321)joint, and no voids were detected in (420) joint. Therefore, to enhance the reliability of solder joints, using (420) orientedSn as solder layer could be an efficient way.
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Avionics Frequency Response Characteristics Testing System
Feng Tian,Fei Sun,Xinyu Chen 보안공학연구지원센터 2016 International Journal of Hybrid Information Techno Vol.9 No.12
To meet the demand of avionics control system's frequency response characteristic and the testing, a new avionics frequency response testing system is proposed. The design uses PXI series card of NI Corporation and the software programming is used in the design, to realize the function of the testing signal's generation, the collection of the response signal, the processing of the sampling data and the mapping of the system's frequency response characteristic curve, and so on. In this paper, the hardware composition, software design, testing steps, and the processing method of data sampling are mainly introduced. The results of application show that the proposed system is economical and reliable. It has a good stability and can meet the avionics system frequency response testing requirements. It not only achieves all the collection of the response signal, analysis and calculation, but also achieves the data storage and playback. The proposed system has the advantages of simple and quick, flexible configuration, portable, low cost, and so on.
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