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Investigation of Pyrolyzed Polyimide Thin Film as MEMS Material
Naka, Keisuke,Nagae, Hideki,Ichiyanagi, Masao,Jeong, Ok-Chan,Konishi, Satoshi The Institute of Electronics and Information Engin 2005 Journal of semiconductor technology and science Vol.5 No.1
Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.
Investigation of Pyrolyzed Polyimide Thin Film as MEMS Material
Keisuke Naka,Hideki Nagae,Masao Ichiyanagi,Ok Chan Jeong,Satoshi Konishi 대한전자공학회 2005 Journal of semiconductor technology and science Vol.5 No.1
Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at 800 oC for 60 minutes in N2 ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about 2.17×10-2 Ωcm. From the result of the load-deflection test, the estimated Young’s modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.