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        Effect of Concentrations of Fe2+ and Fe3+ on the Corrosion Behavior of Carbon Steel in Cl− and SO42− Aqueous Environments

        Kui Xiao,Zhaoliang Li,Jialiang Song,Ziheng Bai,Wei Xue,Junsheng Wu,Chaofang Dong 대한금속·재료학회 2021 METALS AND MATERIALS International Vol.27 No.8

        The concentration of metal ions in aqueous environments signifcantly afects the formation of corrosion products and furthermetal corrosion. In this paper, the electrochemical behavior of carbon steel in the presence of Fe2+ or Fe3+ concentrationin Cl− and SO42− aqueous environments have been investigated using conventional electrochemical methods such as linearpolarization and alternating current impedance spectroscopy. The morphology and composition of carbon steel corrosionproducts were studied using scanning electron microscopy and laser Raman spectroscopy. The efects of corrosion productsand iron ions concentration on the corrosion of carbon steel were discussed. Corrosion products of carbon steel in aqueousenvironments were γ-FeOOH, γ-Fe2O3 and a small amount of α-Fe2O3. The addition of Fe2+ afected the cathode reactionof the electrode reaction, and promotes the formation of γ-FeOOH and Fe3O4. And with the increase of Fe2+ concentrationin the solution, the anode process of electrode reaction was suppressed. The addition of Fe3+ promoted the formation ofγ-Fe2O3 and Fe3O4. Fe3+ afected the ionization of water, causing the pH of the solution to drop. Fe3+ undergoes a redoxreaction with the matrix. Addition of Fe3+ ions promoted the formation of FeOOH, an intermediate product, which reactswith the anode product Fe2+. These factors all accelerated the corrosion process.

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        Initial Corrosion Behavior of a Copper-Clad Plate in Typical Outdoor Atmospheric Environments

        Pan Yi,Kui Xiao,Kangkang Ding,Lidan Yan,Chaofang Dong,Xiaogang Li 대한금속·재료학회 2016 ELECTRONIC MATERIALS LETTERS Vol.12 No.1

        A copper-clad printed circuit board (PCB-Cu) was subjected to long-termexposure test under typical Chinese atmospheric environments to studycorrosion failure mechanisms. The corrosion behavior was investigated byanalyzing electrochemical impedance, scanning Kelvin probes, stereo andscanning electron microscopes, and energy-dispersive spectra. Resultsshowed that the initial surface potential was unevenly distributed. Theoutdoor PCB-Cu samples suffered severe corrosion caused by dust particles,contaminated media, and microorganisms after long-term atmosphericexposure. The initial localized corrosion was exacerbated and progressed togeneral corrosion for samples in Turpan, Beijing, and Wuhan underprolonged exposure, whereas PCB-Cu in Xishuangbanna was only slightlycorroded. The tendency for electrochemical migration (ECM) of PCB-Cuwas relatively low when applied with a bias voltage of 12 V. ECM was onlyobserved in the PCB-Cu samples in Beijing. Contaminated medium and highhumidity synergistically affected ECM corrosion in PCB-Cu materials.

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