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Initial Corrosion Behavior of a Copper-Clad Plate in Typical Outdoor Atmospheric Environments
Pan Yi,Kui Xiao,Kangkang Ding,Lidan Yan,Chaofang Dong,Xiaogang Li 대한금속·재료학회 2016 ELECTRONIC MATERIALS LETTERS Vol.12 No.1
A copper-clad printed circuit board (PCB-Cu) was subjected to long-termexposure test under typical Chinese atmospheric environments to studycorrosion failure mechanisms. The corrosion behavior was investigated byanalyzing electrochemical impedance, scanning Kelvin probes, stereo andscanning electron microscopes, and energy-dispersive spectra. Resultsshowed that the initial surface potential was unevenly distributed. Theoutdoor PCB-Cu samples suffered severe corrosion caused by dust particles,contaminated media, and microorganisms after long-term atmosphericexposure. The initial localized corrosion was exacerbated and progressed togeneral corrosion for samples in Turpan, Beijing, and Wuhan underprolonged exposure, whereas PCB-Cu in Xishuangbanna was only slightlycorroded. The tendency for electrochemical migration (ECM) of PCB-Cuwas relatively low when applied with a bias voltage of 12 V. ECM was onlyobserved in the PCB-Cu samples in Beijing. Contaminated medium and highhumidity synergistically affected ECM corrosion in PCB-Cu materials.