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산화막CMP의 연마균일도 향상을 위한 웨이퍼의 에지형상제어
최성하(Sung Ha Choi),정호빈(Ho Bin Jeong),박영봉(Young Bong Park),이호준(Ho Jun Lee),김형재(Hyoung Jae Kim),정해도(Hae Do Jeong) Korean Society for Precision Engineering 2012 한국정밀공학회지 Vol.29 No.3
There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from non-uniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.
초음파 음향속도를 이용한 잔류응력 측정 방법에 대한 이론 및 평가
김희준(Hee Jun Kim),이모윤(Mo Youn Lee),정호빈(Ho Bin Jeong),박인규(In Gyu Park),조인식(In Sik Cho) 대한기계학회 2019 대한기계학회 논문집. Transactions of the KSME. C, 산업기술과 혁신 Vol.7 No.1
본 논문에서는 초음파잔류응력측정 방법에 대한 기본적인 이론과 직접적인 관련 기초기술인 초음파펄스에코(ultrasonic pulse-echo) 기법과 음탄성(acoustoelasticity) 평가를 위하여 S10C, Al6061, Cu-Zn(65-35) 3 가지 구조재료에 대하여 동탄성계수 및 푸아송비를 측정한 결과 각각 209.8GPa, 68.7GPa, 108.2GPa 및 0.288, 0.259, 0.360 로 측정되었으며, 음탄성(acoustoelasticity)법을 이용한 각 재료에 적용 응력에 따른 종파속도(longitudinal velocity)와 횡파속도(transverse velocity) 를 측정한 결과 적용응력이 증가함에 따라 종파속도는 감소하는 경향을 확인할 수 있었다. 또한 X-ray single beam 법을 이용한 각 재료에 대한 잔류응력 측정결과 phi 0°에서 93.5 MPa, 154.4 MPa, 825.6MPa 이었다. 이러한 측정기반위에 차세대 초음파잔류응력 측정의 핵심 해석 및 장치기술에 대하여 평가하고자 하였다. In this paper, structure materials of S10C, Al6061, and Cu-Zn (65-35) are proposed for the ultrasonic pulseecho technique and acoustoelasticity evaluation, which are directly related to the basic theory of ultrasonic residual stress measurement. The dynamic elastic modulus and poisson "s ratio of the material were measured to be 209.7GPa, 68.7GPa, 108.2GPa and 0.288, 0.259 and 0.360, respectively. The acoustic velocities of each material using acoustoelasticity method longitudinal velocity and transverse velocity were measured. As the applied stress increased, longitudinal velocity decreased. The residual stress of each material using X-ray single beam method was 93.5 MPa, 154.4 MPa, and 825.6 MPa at phi 0 °. On the basis of this measurement, we tried to evaluate the core analysis and device technology of the next generation ultrasound residual stress measurement.