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최적 가공 조건 선정을 위한 300mm 웨이퍼 폴리싱의 가공특성 연구
원종구,이정택,이은상 한국생산제조학회 2008 한국생산제조학회지 Vol.17 No.2
In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio. the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.
원종구,오화용,김민지,김지만 한국공업화학회 2016 한국공업화학회 연구논문 초록집 Vol.2016 No.1
The Supercapacitors can be alternative approach to solving increasing power demands because they can have higher power and transport higher energy compared to batteries. There are two conditions to improve electrochemical performance. First, electrode materials have high surface area or pseudo-active species. Second, high electrical conductivity is important. One of the most promising electrode materials is ordered mesoporous carbon because of its huge specific surface area and pseudo-active sites. However, ordered mesoporous carbons have relatively low electrical conductivity due to amorphous phase. To improve electrical conductivity, we control carbonization temperature of ordered mesoporous carbon. In our study, ordered mesoporous carbons were synthesized by hard template method through impregnation the carbon precursor into the template(SBA-15) then carbonization at 900°C ~ 1450°C. The as-synthesized materials were characterized by XRD, N<sub>2</sub>-sorption isotherm, Raman, and SEM.
Wafer final polishing에 따른 표면 현상과 마멸도에 관한 연구
원종구,이정택,황성철,차지완,이은상 한국공작기계학회 2008 한국공작기계학회 춘계학술대회논문집 Vol.2008 No.-
In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that final polishing is very important. Polishing one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the evaluation on abrasion of wafer according to variety processing condition, which have major influence on the abrasion and surface defect of Si wafer polishing, were adapted to polishing pressure, machining speed, and the slurry mix ratio. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result. By using optimum condition, it achieve a ultra precision mirror like surface.
균일 가압을 적용한 Wafer Polishing 가공 성능에 관한 연구
원종구,이정택,이은상 한국공작기계학회 2006 한국공작기계학회 추계학술대회논문집 Vol.2006 No.-
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.
연속전해드레싱을 적용한 머신어블 세라믹의 초정밀 래핑 가공
원종구,이은상 한국공작기계학회 2003 한국생산제조학회지 Vol.12 No.3
In-process Electrolytic Dressing is a lapping method using electrolysis. This technology provides dressing to CIB-Diamond Lapping wheels during the lapping process for continuous protrude abrasive from super-abrasive wheels. so loading and glazing are disappeared apparently. Ultra-precision lapping of the machinable ceramics will be studied in the viewpoint of In-process Electrolytic Dressing. For ultra-precision lapping, need to develop an ultra-precision lapping system, suitable metal bonded diamond wheel, and appropriate condition of ultra-precision lapping machining.
원종구,오화용,황윤경,( Jinxing ),김지만 한국공업화학회 2016 한국공업화학회 연구논문 초록집 Vol.2016 No.0
The Supercapacitors are energy storage devices using electrochemical double layer capacitors or pseudo-capacitors. Supercapacitors can be alternative approach to solving increasing power demands. There are two conditions to increase electrochemical performance supercapacitors. : 1) high-capacitance material that have high surface area or pseudo-active site is needed. 2) high electrical conductivity material is a key factor. Ordered mesoporous carbons have been known as candidate electrode materials because of huge specific surface area and pseudo-active sites. However, ordered mesoporous carbons have relatively low electrical conductivity due to amorphous phase. To improve electrical conductivity, we control carbonization temperature of ordered mesoporous carbon. In our study, ordered mesoporous carbons(CMK-3) were synthesized by controlling carbonization temperature from 900℃ to 1450℃. The as-synthesized materials were characterized by XRD, N2-sorption isotherm, Raman, and SEM.
실험계획법을 적용한 웨이퍼 폴리싱의 최적 조건 선정에 관한 연구
원종구(Jong-Koo Won),이정훈(Jung-Hun Lee),이정택(Jung-Taik Lee),이은상(Eun-Sang Lee) 한국생산제조학회 2008 한국생산제조학회지 Vol.17 No.1
The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.
균일 가압을 적용한 Wafer Polishing 가공 성능에 관한 연구
원종구(J.K Won),이정택(J.T Lee),이은상(E.S Lee) 한국생산제조학회 2006 한국공작기계학회 춘계학술대회논문집 Vol.2006 No.-
Wafer polishing makes the surface planarization to achieve a high-quality. The pressure distribution is an important parameter of polishing process. This study shows the pressure distribution between the polishing pad and the wafer attached by machine's head. The experiments were performed to observe the morphology of pressure, when the machine's head was pressed down onto the polishing pad. It is found that the pressure distribution is depended on the damping materials in the preliminary experiment. To measure the pressure distribution, the pressure measuring film is used. The simulation result of head is compared with the measured pressure distribution. As the static pressures are compared, it will be shown the status of pressure by the damping materials of machine's head. On polishing experiment, vibration and frequency were measured and analyzed.