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박제영,최용범,김규한,조광현 대한피부과학회 2002 大韓皮膚科學會誌 Vol.40 No.8
Acute hemorrhagic edema of childhood is an uncommon form of cutaneous leukocytoclastic vasculitis that occurs in children younger than 3 years. This is characterized by tender edema and rosette-shaped purpuric patches that generally resolve without intervention. We describe a 26-month-old boy with acute hemp rhagic edema of childhood, in whom the disease appeared after an acute respiratory illness. Skin lesions presented with acral edema, and rosette-shaped purpuric plaques on the face and limbs. Some authors consider the disease as a purely cutaneous form of Henoch-Schoenlein purpura, but it is more likely that acute hemorrhagic edema of childhood could be regarded as a distinct entity within leukocytoclastic vasculitis.
충전성을 개선한 각형CFT 기둥-보 접합부의 구조 특성
박제영,이명재,Park, Je Young,Lee, Myung Jea 한국강구조학회 2013 韓國鋼構造學會 論文集 Vol.25 No.2
CFT구조의 기둥-보 접합부는 강관의 국부좌굴을 방지하기위해 다이아프램이 필요하다. 외측다이아프램 형식은 관통다이아프램 형식보다 콘크리트의 충전성이 좋으나 시공성과 건축설비와 공조하는 측면에서 불편함이 있다. CFT구조 접합부의 상부 다이아프램은 외측다이아프램 형식으로 하고 하부 다이아프램은 관통다이아프램 형식으로 하였다. 이것은 건축물에서 바닥슬래브가 있으므로 상부 다이아프램은 바닥슬래브와 일체가 되고 하부 다이아프램으로 관통다이아프램을 적용하여 건축설비와의 마찰을 피하고자 한 것이다. 결과적으로 충전성을 개선시킨 CFT구조의 구조성능은 상, 하부 모두 관통다이아프램을 적용한 구조와 비교하면 동일하다는 것을 알 수 있다. CFT structures require a diaphragm to prevent buckling of steel at connections. An outer diaphragm has better concrete filling than a through diaphragm due to a large bore, but due to the larger size than the through diaphragm, it has poorer constructability and cooperation with building equipment. The building structure has a floor slab that was unified with the upper diaphragm, so the outer diaphragm was placed at the upper bound. Moreover, the through diaphragmwas placed at the lower connection to avoid obstruction of the building equipment. The CFT structure with the improved concrete filling showed the same structural behavior as the CFT structure with the use of the same type of diaphragms at the upper and lower connections.
충전성을 개선한 각형CFT구조의 기둥-보 접합부 구조적 거동
박제영,이명재 대한건축학회 2012 대한건축학회논문집 Vol.28 No.11
<P> Concrete-Filled Tube is a concrete-filled steel tube structure. Steel tube confines the concrete to increase the compressive strength, and the concrete contains the buckling of the tube. CFT structures require a diaphragm to prevent buckling of steel at connections. An outer diaphragm has better concrete filling than a through diaphragm due to a large bore, but being larger than the through diagram, it has poorer constructability and cooperation with building equipment. In this study, a rectangular CFT structure that uses different types of diaphragms in its upper and lower connections to improve the concrete filling was tested and analyzed via the FEM program. The building structure had a floor slab that was unified with the upper diaphragm, so the outer diaphragm was placed at the upper bound. Moreover, the through diaphragmwas placed at the lower connection to avoid obstruction frombuilding equipment. The CFT structure with the improved concrete filling showed the same structural behavior as the CFT structure with the use of the same type of diaphragms at the upper and lower connections.</P>
박제영,차두열,김성태,강민석,김종희,장성필,Park, Je-Yung,Cha, Doo-Yeol,Kim, Sung-Tae,Kang, Min-Suk,Kim, Jong-Hee,Chang, Sung-Pil 한국전기전자재료학회 2007 전기전자재료학회논문지 Vol.20 No.12
Lots of integration work has been done in order to miniaturize the devices for communication. To do this work, one of key work is to get miniaturized inductor with high Q factor for RF circuitry. However, it is not easy to get high Q inductor with silicon based substrate in the range of GHz. Although silicon is well known for its good electrical and mechanical characteristics, silicon has many losses due to small resistivity and high permittivity in the range of high frequency. MEMS technology is a key technology to fabricate miniaturized devices and LTCC is one of good substrate materials in the range of high frequency due to its characteristics of high resistivity and low permittivity. Therefore, we proposed and studied to fabricate and analyze the inductor on the LTCC substrate with MEMS fabrication technology as the one of solutions to overcome this problem. We succeeded in fabricating and characterizing the high Q inductor on the LTCC substrate and then compared and analyzed the results of this inductor with that on a silicon and a glass substrate. The inductor on the LTCC substrate has larger Q factor value and inductance value than that on a silicon and a glass substrate. The values of Q factor with the LTCC substrate are 12 at 3 GHz, 33 at 6 GHz, 51 at 7 GHz and the values of inductance is 1.8, 1.5, 0.6 nH in the range of 5 GHz on the silicon, glass, and LTCC substrate, respectively.