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全永鎬,權彛章 弘益大學校 科學技術硏究所 1995 科學技術硏究論文集 Vol.6 No.-
This paper describes a highly accelerated life test (HALT, USPCBT) method for rapid qualification testing of STH PWB(Silver Through Hole Printed Wire Boards). This method was carried to be an alternative to the present time-consuming standard 1344 hours life testing(THB). The accelerated life test conditions were 121℃ 95%R. H. at 50V bias and without bias. Their results are compared with those observed in the standard 1344 hours life test at 40℃/95%R.H. at 50V bias and without bias. The studied were focused on the samples' time-to-failure as well as the associated conduction and failure mechanism. The abrupt drop of insulation resistance is due to the absorption of water vapour. And the continuous drop of insulation resistance is due to the Ag migration. The ratio of time-to-failure of HALT(USPCBT) samples to THB was 25 and 11 at 50V bias and without bias respectively.