With the increasing use of SiC and GaN devices, the demand for reliable gate drivers has grown. A critical requirement for these drivers is galvanic isolation, which ensures safety, prevents ground loops, and provides better high-voltage separation an...
With the increasing use of SiC and GaN devices, the demand for reliable gate drivers has grown. A critical requirement for these drivers is galvanic isolation, which ensures safety, prevents ground loops, and provides better high-voltage separation and noise immunity. Compared to traditional junction isolation, galvanic isolation handles higher voltages and performs better in high-speed switching, making it more suitable for SiC/GaN devices, which require effective isolation to ensure stability and efficiency. In high-speed switching, high common-mode transient immunity (CMTI) is essential to minimize noise and maintain stable operation.
This paper presents two types of galvanic-isolated gate drivers for SiC and GaN power devices: one using capacitive isolation and the other using transformer-based isolation. The capacitive isolation driver proposes a counter-based modulation technique, replacing the traditional OOK modulation method, to ensure high CMTI. In the transformer-based isolation driver, a bleeder circuit is proposed to enhance CMTI performance, ensuring stable operation in harsh environments. The transformer isolation design provides robust electrical separation between the control and power stages, while the bleeder circuit suppresses common-mode transients, maintaining high noise immunity.
The proposed galvanic isolation gate driver has been implemented in a 130nm BCD process. Simulation results show that the driver guarantees a CMTI of over 300V/ns and an isolation rate of at least 400V.