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- 저자 : Siva Venkatachalam (검색결과 1 건)
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Effects of Microstructure on Ultraprecision Machining and Grinding
Steven Y. Liang,Siva Venkatachalam,Hyung Wook Park 한국생산제조학회 2012 한국생산제조시스템학회 학술발표대회 논문집 Vol.2012 No.10
The roles of crystallography in the integrity of the parts produced in ultraprecision machining and grinding processes have been quantitatively studied. In ultraprecision machining and grinding the tool geometry features and the process parameters are on the same order of magnitude as the grain size; therefore, the material microstructural attributes in the context of grain size, grain boundaries, crystallographic orientation, etc. can be important. For machining, the grain size, having an effect on the material yield stress via the Hall-Petch model, is represented by a log-normal distribution while the effects of grain boundary and orientation have been modeled using the dislocation principles. For grinding, combined consideration of mechanical and thermal effects within a single grit interaction model of material removal in coupling with the topography and material crystallographic effects has been examined to predict the grinding forces. This study aims to provide a clear understanding of the crystallographic effects to allow for the ultimate goals of prediction, planning, optimization, and control of ultraprecision material removal and finishing processes.
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