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        Fabrication process of a microstructures based on hydrogenated amorphous SiGe films for applications in MEMS devices

        M. Galindo-Mentle,F. López-Huerta,R. Palomino-Merino,C. Zúñiga-Islas,W. Calleja-Arriaga,A. L. Herrera-May 대한기계학회 2015 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.29 No.4

        We present a fabrication process of microstructures using both boron-doped hydrogenated amorphous silicon and hydrogenated amorphoussilicon-germanium (a-SiB:H and a-Si0.5Ge0.5B:H) films for applications in devices based on microelectromechanical systems(MEMS). These microstructures are fabricated through plasma enhanced chemical vapor deposition (PECVD) with a low temperature of300°C at 110 kHz and a pressure of 0.6 Torr. The proposed microstructures have three different geometries (Diamond, cantilever andbridge) considering a single structural layer of 1 μm thickness and are fabricated using surface micromachining. The fabricated a-Si0.5Ge0.5B:H microstructures do not present sticking problems and have good mechanical stability, which can allow their use in MEMSdevices. Our fabrication process with hydrogenated amorphous SiGe films is simple. This process decreases the residual stress of themicrostructures and allows the metal deposition on the microstructures surfaces.

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        Effect of 3,5-Diaminobenzoic Acid Content, Casting Solvent, and Physical Aging on Gas Permeation Properties of Copolyimides Containing Pendant Acid Groups

        R.M. Huertas,E.M. Maya,J. de Abajo,J.G. de la Campa 한국고분자학회 2011 Macromolecular Research Vol.19 No.8

        A series of copolyimides containing carboxylic acid groups have been prepared from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and two diamines, 2,4,6-trimethyl-1,3-phenylenediamine and bis(4-amino-3-isopropyl-5-methylphenyl)methane. Carboxylic acid groups were introduced using 3,5-diaminobenzoic acid (DABA) as a comonomer in different proportions in both series of polyimides. The polymers were fully characterized using spectroscopic and thermal analysis techniques. The gas permeation properties of the polymer films were investigated and the results were explained mainly by anhydride formation, which depended not only on the -COOH content, flexibility, and structure of the polymer chain but also on the thermal treatment of the membrane. Copolyimides with the lowest DABA content of both series showed the best permeation properties, particularly the copolyimide that contained 25% of acid units, which showed O_2, N_2, CH_4, and CO_2 permeability coefficients close to 40, 10, 7, and 145 barrers, respectively. The gas separation properties were evaluated using three different casting solvents, N-methylpyrrolidinone, tetrahydrofuran, and acetone. At the initial stage, large differences in permeability coefficients were obtained for each copolyimide. On the other hand, after 1,000 h aging at room temperature,the membranes of each series showed similar permeability coefficients.

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