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- 저자 : Anthony G. Evans (검색결과 1 건)
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마이크로 및 나노 박막의 잔류응력을 측정하기 위한 새로운 방법
강기주(Ki-Ju Kang),Anthony G. Evans 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.4
A new method to measure residual stress in micron and nano scale films is described. In the theory it is<br/> based on Linear Elastic Fracture Mechanics. And in the techniques it depends on the combined capability of<br/> the focused ion beam (FIB) imaging system and of high-resolution digital image correlation (DIC) software.<br/> The method can be used for any film material (whether amorphous or crystalline) without thinning the<br/> substrate. In the method, a region of the film surface is highlighted and scanning electron images of that<br/> region taken before and after a long slot, depth a, is introduced using the FIB. The DIC software evaluates the<br/> displacement of the surface normal to the slot due to the stress relaxation by using features on the film surface.<br/> To minimize the influence of signal noise and rigid body movement, not a few, but all of the measure<br/> displacements are used for determining the real residual stress. The accuracy of the method has been assessed<br/> by performing measurements on a nano film of diamond like carbon (DLC) on glass substrate and on micro<br/> film of aluminum oxide thermally grown on Fecrally substrate. It is shown that the new method determines<br/> the residual stress R σ =-1.73 GPa for DLC and R σ =-5.45 GPa for the aluminum oxide, which agree quite<br/> well with ones measured independently.
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