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      저자 : Andreas MUSING (검색결과 3 건)
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        Switching Transient Shaping by Application of a Magnetically Coupled PCB Damping Layer

        Hartmann, Michael,Musing, Andreas,Kolar, Johann W. The Korean Institute of Power Electronics 2009 JOURNAL OF POWER ELECTRONICS Vol.9 No.2

        An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.

      • Switching Transient Shaping of RF Power MOSFETs for a 2.5 ㎒, Three-Phase PFC

        Michael HARTMANN,Andreas MUSING,Johann W. KOLAR 전력전자학회 2007 ICPE(ISPE)논문집 Vol.- No.-

        To increase the power density of active rectifiers, the switching frequency and switching-speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this paper, a novel magnetically coupled damping layer is introduced for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines are given. The effectiveness of the introduced layer is determined by layout parasitics, which are calculated with the Partial Element Equivalent Circuit method and compared to impedance measurements. The performance of the damping layer is demonstrated by simulations and verified via measurements on a laboratory prototype.

      • KCI등재

        Switching Transient Shaping by Application of a Magnetically Coupled PCB Damping Layer

        Michael Hartmann,Andreas Musing,Johann W. Kolar 전력전자학회 2009 JOURNAL OF POWER ELECTRONICS Vol.9 No.2

        An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltageand current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.

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