http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
오늘 본 자료
Cu 에 대한 Sn-3.5Ag 계 땜납의 젖음성 및 계면반응
백대화(Dae Hwa Baek),이경구(Kyung Ku Lee),박효병(Hyo Byeong Park),정명준(Myung Jun Geong),이도재(Doh Jae Lee) 한국주조공학회 1999 한국주조공학회지 Vol.19 No.3
The wettability and interfacial reaction between Sn-3.5Ag solders and Cu-substrate were examined as a function of alloying element (1Pb, 1Sb) and soldering time. Cu/solder joints were subjected to aging treatments for up to 60 days at 150˚C to observe interfacial compounds and changes of microstructure by optical microscopy, SEM and EDS. The addition of 1Pb to the Sn-3.5Ag solder improves the wetting characteristics of the alloy and lowers the melting temperature. The growth rate of the Cu_6Sn_5 layer in the Sn-3.5 Ag solder/Cu was faster than that in the Sn-3.5Ag-1Sb solder/Cu. The activation energy for Cu_6Sn_5 growth was estimated as 31∼35 kJ/mole. (Received January 15, 1999)