http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
김승빈(Seungbin Kim),신지혁(Jihyeok Shin),강지훈(Jihoon Kang),김원해(Wonhae Kim),이용석(Yong-Seok Lee) 대한기계학회 2023 대한기계학회 춘추학술대회 Vol.2023 No.11
Creep behavior of solder ball in electronic packaging is one of the main concerns. Solder alloy can reach 50% of its melting point easily when application is operated. As a result, manufacturers should consider solder creep because creep behavior is dominant over 0.4Tm of solder alloy. In this research, we made quarter model of ball-grid-array electronic package through finite element analysis. Simulation cases consisted of 9 cases according to solder ball position arrangement, and creep analysis was performed with a cycle of thermal profile -45℃ ~125℃. Therefore, we suggested which case is the optimum arrangement for creep fatigue life and mechanical reliability of ball-grid-array packaging.