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Navigation Connection용 ACF(Anisotropic Conductive Film)의 수명 예측
유영창(Yeong-Chang Yu),신승중(Seung-Jung Shin),곽계달(Kae-Dal Kwack) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.