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90-Day Oral Toxicity Assessment of Tropaeolum majus L. in Rodents and Lagomorphs
Valdinei de Oliveira Araujo,Carlos Eduardo Linhares Andreotti,Michelle de Paula Reis,Daniely Alves de Lima,Karoline Bach Pauli,Bruna Caroline Nunes,Caroline Gomes,Ricardo de Melo Germano,Euclides Lara 한국식품영양과학회 2018 Journal of medicinal food Vol.21 No.8
Tropaeolum majus L., popularly known as nasturtium, is a species widely used in the form of infusions and salads. In the last years, the antihypertensive, diuretic, and calcium and potassium sparing activities of T. majus preparations were shown. Moreover, no preclinical 90-day oral toxicity studies were conducted. Thus, this study evaluated the toxicity of the hydroethanolic extract obtained from T. majus (HETM) leaves in female and male mice, rats, and rabbits. Swiss mice and Wistar rats were treated with HETM (75, 375, and 750 mg/kg). The doses of rabbits (30, 150, and 300 mg/kg) were calculated by allometric extrapolation. The control groups received vehicle. The animals were orally treated, daily, for 90 days. At the end, the animals were anesthetized, and body weight gain, relative weight of liver, kidney, and spleen, and histopathological changes were evaluated. Serum hematological and biochemical parameters were also analyzed. No alterations were found in body and organ weights or in histopathological and biochemical evaluation. Hematological analyses revealed small changes in lymphocytes and neutrophil counts in rats after administration of 750 mg/kg of HETM. These results showed that 90-day use of T. majus is safe in rodents and lagomorphs.
Piersanti, Stefano,de Paulis, Francesco,Olivieri, Carlo,Jung, Daniel H.,Kim, Joungho,Orlandi, Antonio [Institute of Electrical and Electronics Engineers 2017 IEEE transactions on electromagnetic compatibility Vol.59 No.5
<P>Small form factors and high bandwidth are two imperatives nowadays for three-dimensional integrated circuits (3-D-ICs). These requirements can be achieved by the use of through silicon vias, by the reduction of their radius and, at the same time, of the pitch among them. Having a considerable number of devices in a limited space inevitably increases the probability of the creation of defects (short, open, void, etc.). The study of the nature, topology, and creation mechanism of defects is crucial for 3-D-IC design. This paper suggests a procedure able to determine the nature of a defect (open-or short-circuit) and to estimate its position, basing its approach on the study of the electrical parameters of the defected structure, avoiding the use of invasive method such as Lock-in Thermography. A daisy-chain structure is manufactured and open or short defects are intentionally placed along the channel. With and without defects, the equivalent capacitance and inductance are extracted from the S-Parameters, from measurement and three-dimensional electromagnetic simulations, and used to define and validate the proposed procedure.</P>
Marcia Alessandra Arantes Marques,Bruno Henrique Lopes Botelho Lourenc¸o,Michelle de Paula Reis,Karoline Bach Pauli,Andre´ Luiz Soares,Salviano Tramontin Belettini,Guilherme Donadel,Rhanany Alan Callo 한국식품영양과학회 2019 Journal of medicinal food Vol.22 No.3
Osteoporosis is a systemic bone disease that is characterized by impairments in bone strength that predispose an individual to a higher risk of fractures. Despite the various etiologies, undoubtedly the most important factors are aging of the population and hypogonadism. Although several therapeutic options are available, pharmacological treatments have some risks. Among these are increases in the incidence of thrombosis, breast cancer, ovarian cancer, endometrial cancer, and muscle injury, among others. Herbal medication may be an alternative for the treatment of osteoporosis. Thus, the aim of this study was to evaluate the therapeutic effect of a standardized extract of Tribulus terrestris L. (TT) on ovariectomy (OVX)-induced bone loss in rats. Female rats were first subjected to OVX and treated with TT (3, 30, and 300 mg/[kg·day]) or furosemide (25 mg/kg) orally for 28 days. Bone densitometry and tibial histology were performed, and acute renal function and testosterone, dehydroepiandrosterone (DHEA), and estradiol levels were assessed. Prolonged treatment with TT stimulated bone mass gain in all ovariectomized animals, raising bone mass to levels that were similar to sham-operated rats. DHEA levels significantly increased in TT-treated rats. The TT group also had lower calcium (Ca2+) excretion that OVX control and furosemide-treated rats. Finally, the histopathological analyses showed the maintenance of bone turnover in all TT-treated groups. Overall, the results indicate that the standardized extract of T. terrestris exerted a bone-protective effect by increasing bone mineral density. This activity may be at least partially attributable to an increase in serum DHEA levels and a Ca2+-sparing effect.
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Jung, Daniel H.,Youngwoo Kim,Kim, Jonghoon J.,Heegon Kim,Sumin Choi,Yoon-Ho Song,Hyun-Cheol Bae,Kwang-Seong Choi,Piersanti, Stefano,de Paulis, Francesco,Orlandi, Antonio,Joungho Kim IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.1
<P>Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic devices. As the system design aims for higher performance, the physical dimensions of the channels are continuously decreasing. With TSV diameter of less than 10 mu m and pitch of several tens of micrometers, the I/O count has increased up to the order of tens of thousands for wide bandwidth data transmission. However, without highly precise fabrication process, such small structures are susceptible to a variety of defects. For the first time, in this paper, we propose a noninvasive defect analysis method for high-speed TSV channel. With designed and fabricated test vehicles, the proposed method is demonstrated with S-parameter and time-domain reflectometry measurement results. In addition, we present equivalent circuit models of TSV daisy-chain structures, including the circuit components for open defect and short defect. With characterized dominant factors in each frequency range, S-11 is analyzed to distinguish and locate the defects by the amount of capacitance, resistance, and inductance that the signal experiences. S-parameter measurement sufficiently allows high-frequency defect analysis of TSV channel without destroying the test sample. We experimentally verified the accuracy of the suggested model by comparing the S-parameter results from circuit simulations and measurements. Finally, the model is modified to discuss the effects of open defect and short defect on the electrical characteristics of TSV channel.</P>
Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC
Kim, Dong-Hyun,Kim, Youngwoo,Cho, Jonghyun,Bae, Bumhee,Park, Junyong,Lee, Hyunsuk,Lim, Jaemin,Kim, Jonghoon J.,Piersanti, Stefano,de Paulis, Francesco,Orlandi, Antonio,Kim, Joungho IEEE 2017 IEEE transactions on components, packaging, and ma Vol.7 No.6
<P>We propose, for the first time, an explicit semiconductor physics-based through-silicon via (TSV) capacitance-voltage (CV) model. The effect of TSV CV hysteresis is demonstrated in the model, and the TSV capacitance is modeled with respect to dc bias voltage and the dimension of the TSV. The proposed model is verified by comparison to the measurement results. The effect of hysteresis in the model correlates well with the measurement results. This model can be utilized in a circuit level simulation to expand the possible application of the model to, but not limited to, hierarchical power distribution network impedance analysis, RC delay analysis, input-output power consumption analysis, and crosstalk and eye diagram simulation in any 3-D-IC systems using TSVs.</P>