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Enhanced Thermal Conductivity of BN/SR Composites via Biomass‑Modifcation of BN
Yanting Zhang,Cheng Cai,Tao Chen,Chonggang Wu,Xinghou Gong,Jiang Hong,Tao Hu 대한금속·재료학회 2023 ELECTRONIC MATERIALS LETTERS Vol.19 No.2
As microelectronics technology advances and develops, issues such as heat management and reliability of electronic componentswill become more exposed. Here, this paper explored a green biomass modification method for preparing compositeswith both good thermal conductivity and dielectric properties. Namely, boron nitride (BN) was first surface coated with thecopolymerization product of tea polyphenols and theophylline, both of which can be extracted from tea leaves. Then, throughsolution blending the coated-BN (BN@TPP) with silicone rubber (SR), the BN@TPP/SR composites were obtained. Owingprobably to the coated layer, BN@TPP were more evenly dispersed within the SR matrix, which effectively reduced theinterfacial thermal resistance and improved the thermal conductivity of composites. The thermal diffusion coefficient andthermal conductivity of 40 wt% BN@TPP/SR composites reached 0.216 mm2/s and 0.462 W/mK, which are higher thanBN/SR composites (0.155 mm2/s, 0.349 W/mK), respectively. Meanwhile, the 40 wt% BN@TPP/SR composite maintaineddielectric constant (3.9 at 1 kHz) and low dielectric loss (0.005 at 1 kHz). In conclusion, this green biomass modificationmethod not only provides a simple and environmentally friendly modification method for BN, but also offers a novel ideathat can be applied to the practical preparation of thermally conductive materials for electronic devices.
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