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Interfacial Void Segregation of Cl in Cu-Sn Micro-Connects
Glenn Ross,Xiaoma Tao,Mikael Broas,Nikolai Mäntyoja,Vesa Vuorinen,Andreas Graff,Frank Altmann,Matthias Petzold,Mervi Paulasto-Kröckel 대한금속·재료학회 2017 ELECTRONIC MATERIALS LETTERS Vol.13 No.4
A scanning transmission electron microscopy and an energy dispersiveX-ray analysis of one non-annealed and one annealed sample (423 Kfor 4 hours) was performed. The results showed small and large voidsappearing within the non-annealed and annealed samples respectively. In addition, chlorine segregated from the bulk into the voids. Ab initiocalculations determined the formation energies for dilute solutions ofchlorine and vacancies in Cu, Cu3Sn and Cu6Sn5. Results suggest thatdilute solutions energetically favor vacancies, indicating a low chlorinesolubility and a driving force for segregation.