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A High Throughput Voice Pairgain Chip for HDSL Systems
Uvieghara,Gregory,Larson,Kirk,Cadieux,Kevin,Morse,Doug 대한전자공학회 1997 ICVC : International Conference on VLSI and CAD Vol.5 No.1
This paper describes a voice pairgain chip, which when used in conjunction with an HDSL transceiver, can transport up to 18 simultaneous phone conversations over a single twisted pairgain copper wires. It has an advantage over ISDN-based voice pairgain chips since it does not have to rely on voice compression to achieve high throughput.