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Raj Kumar Kaushik,Uma Batra,J. D. Sharma 대한금속·재료학회 2021 METALS AND MATERIALS International Vol.27 No.11
Low drop failure tendency and reduced cost of low silver SAC alloys has provoked researchers to exploit their potential forportable electronics. Low Bi addition in near-eutectic SAC alloys has proven confinement of IMC layer. In order to exploitpotential of Ag variation (0.5–1.5 wt%) on structural, thermal, wettability and IMCs layers growth during thermal aging inlow Bi-low Ag, Sn–xAg–0.7Cu–1.0Bi alloys were investigated. The resulting microstructure were characterized by scanningelectron microscopy, energy dispersive spectroscopy and X-ray diffraction. Furthermore, structure–property correlationswere established. This study signifies that 1.5 wt% Ag is responsible for lower melting point (220.18 °C) and lower contactangle (33°) in low Bi-low Ag, Sn–xAg–0.7Cu–1.0Bi alloys. Moreover, increment in Ag content restricted the interfacial IMClayer growth during thermal aging making them reliable for use in portable electronics. The microstructural investigationsinferred that 0.5 wt% Ag solder joint with Cu substrate had the highest growth rate (0.34 μm/h1/2) of IMC layer thicknesswhile 1.5 wt% Ag solder joint had lowest growth rate (0.17 μm/h1/2).
Raj Kumar Kaushik,Uma Batra,J. D. Sharma 한국전기전자재료학회 2022 Transactions on Electrical and Electronic Material Vol.23 No.4
The Continuous miniaturization of electronics set stringent requirements of corrosion resistance as imposed by high-density packaging. The present work elucidates electrochemical corrosion behaviours of two conventional lead-free solder alloys, i.e., Low-Ag (Sn–1.0Ag–0.5Cu, SAC105) and High-Ag (Sn–3.8Ag–0.7Cu, SAC387) solder alloys. The Electrochemical Impedance Spectroscopy and Potentiodynamic polarization performed in naturally aerated 0.5 M NaCl solution for 1 h, 24 h, 168 h, 336 h, 504 h and 672 h suggest that SAC387 solder offers higher corrosion resistance than SAC105 solder. The SAC105 solder is sparsely cover with fine-fi brous corrosion product, while platelet-like and fi brous mass entirely covers SAC387 solder. Microstructural and elemental characterization of corrosion product revealed the presence of tin oxide, Cu and Ag containing products as several pit, cracks and pore-like structures.