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- 저자 : Schlag, S. (검색결과 1 건)
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Submicron Precious Metal Powders for Microelectronics
Schlag, S.,Meyer, E. M.,Sexton, P.,Mcneilly, K. 한국마이크로전자및패키징학회 1998 International Symposium on Microelectronics and Pa Vol.1 No.1
Precious metal powders and flakes as a component of thick film pastes and conductive adhesives cover a wide range of applications in microelectronics. Contnued size reduntion and increasing packaging density of microelectronics components arc consequently demanding smaller particle sizes t powders and flakes. This paper describes a serievs of submicron irecious rrletapowders including gold, sile:r, palladium. anct palladium-silver. It discusses thu physicocherrical properties of these powuers with view to trleir applications. Submicron particle size is necessary when layer thickness of printed thickfilms should be as low as one micron, which is the case in ceramic multilayer capacitors. Ultrasmall particles are advantageous when high definition of printed line is desired. Increased specific surface area, which corner along with decreasing particle size, improves activity of precious metal parts ire sensor applications. Largo specific surface area of submicron powders, however. substantially increases interharticle forces. Latter have to have overcome to yield high powder density, and good dispersion properties as needed for various electronic applications. Physical and physicochemical strategics to achieve tire desireca properties are discussed and results obtained for different powder types are shown.
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