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Effects of multi-layer graphene capping on Cu interconnects
Kang, Chang Goo,Lim, Sung Kwan,Lee, Sangchul,Lee, Sang Kyung,Cho, Chunhum,Lee, Young Gon,Hwang, Hyeon Jun,Kim, Younghun,Choi, Ho Jun,Choe, Sun Hee,Ham, Moon-Ho,Lee, Byoung Hun IOP Pub 2013 Nanotechnology Vol.24 No.11
<P>The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2–7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimization, MLG capped Cu interconnects could become a promising technology for high density back end-of-line interconnects.</P>