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Effect of Several Exterior Adhesive Types on Dimensional Stability of Bamboo Oriented Particleboard
Iswanto, Apri Heri,Munthe, Rensus,Darwis, Atmawi,Azhar, Irawati,Susilowati, Arida,Prabuningrum, Dita Sari,Fatriasari, Widya Materials Research Society of Korea 2019 한국재료학회지 Vol.29 No.5
The objective of this research is to evaluate the effect of adhesive types on dimensional stability of bamboo-oriented particleboard. The materials used in this research are bamboo tali(Gigantochloa apus J.A & J.H. Schult. Kurz), UF/MDI(8, 10, 12 % level), and MF, MDI, and PF at 7 % level. Particle and adhesive are mixed using a blending machine; then, mat forming and hot pressing processes are performed using adhesive-suitable temperature and time references. MDI resin is set at $160^{\circ}C$ temperature for 5 minutes. PF resin and MF resin are pressed at $170^{\circ}C$ for 10 minutes, and $140^{\circ}C$ for 10 minutes, respectively, while UF/MDI sets at temperature of $140^{\circ}C$ for 10 minutes. The results show that particleboard using PF resin produces the lowest thickness swelling value. The particleboard using UF/MDI resin also produces good response for thickness swelling value. Interesting things happen in that UF/MDI adhesive produces a thickness swelling value better than that of MDI resin. FTIR analysis on particleboard bonded by UF/MDI resin combination shows the presence of carbonyl group C=O vibration on multi substitution of urea at wave number of around $1,700cm^{-1}$.