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Moez Ayadi,Moez Ghariani,Amine Toumi 대한전기학회 2016 Journal of Electrical Engineering & Technology Vol.11 No.5
This paper presents a PFCVF (Power Factor Correction) rectifier that uses a variable frequency source for alternators in electric and hybrid vehicles application. This technique allows to preserve a good THD (Total Harmonic Distortion) of the input source at any frequency and to decrease losses in semiconductors switches, thereby permitting more stability and decreasing the apparent power requirements. A comparative study between the standard and the new technique is made. A thermal network is used to calculate the junction temperatures in order to estimate the equivalent losses in the rectifier with respect of junction temperature modifications and power equilibrium. The relations of the proposed model are defined and simulation results as well as experimental results are discussed.
Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules
Ayadi, Moez,Bouguezzi, Sihem,Ghariani, Moez,Neji, Rafik The Korean Institute of Power Electronics 2014 JOURNAL OF POWER ELECTRONICS Vol.14 No.6
The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.
Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules
Moez Ayadi,Sihem Bouguezzi,Moez Ghariani,Rafik Neji 전력전자학회 2014 JOURNAL OF POWER ELECTRONICS Vol.14 No.6
The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.