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Zhang, Shuye,Yang, Ming,Wu, Yang,Du, Jikun,Lin, Tiesong,He, Peng,Huang, Mingliang,Paik, Kyung-Wook IEEE 2018 IEEE transactions on components, packaging, and ma Vol.8 No.3
<P>Although cationic epoxy was optimized for low-melting SnBi58 solder ACF joints with the lowest coefficient of thermal expansion (CTE) in terms of reliability, cationic epoxy also showed a faster curing property than any other types of adhesives. In fact, solder joint shapes at 250 °C bonding are very different from those shapes at 200 °C bonding. In this paper, four adhesive film types were investigated in terms of Sn-3Ag-0.5Cu solder ACF joint shapes on the electrical performances and reliability in a pressure cooker test (PCT). Thermal stability of adhesive films was tested to be first. Resin curing speeds were measured in a 250 °C isothermal mode differential scanning calorimetry, resin viscosities were checked by a parallel-plate rheometer, and adhesive thermomechanical properties, such as modulus and CTE, were characterized. Then, four different types of ACF resins containing the same weight percentages of Sn-3Ag-0.5Cu solders were assembled by the same thermocompression bonding parameter (250 °C 10s 2MPa on bump) on a 500- <TEX>$\mu \text{m}$</TEX>-pitch flex-on-board (FOB) application, and different solder joint morphologies were verified. Various bonded solder ACFs joints were compared in terms of solder wetting areas, electrical performances by a four-point-probe method, and the reliability of PCT (121 °C 100% humidity 2atm) for 120 h. This paper aims at optimizing the best adhesive film candidate for SAC305 solder ACF joints of FOB application.</P>
MEILING ZOU,HAN ZHU,PAN WANG,MINGLIANG DU,MING ZHANG,SHIYONG BAO 성균관대학교(자연과학캠퍼스) 성균나노과학기술원 2014 NANO Vol.9 No.3
In this paper, epigallocatechin gallate (EGCG) was used as a green reductant both for thefabrication of soluble reduced graphene oxide (rGO) and the synthesis of Au nanoparticles/rGOnanocomposite. Fourier transform infrared (FTIR) spectra con¯rmed the e±cient removal of theoxygen-containing groups in graphene oxide (GO) through the reduction act of EGCG. Aunanoparticles (AuNPs) were anchored onto the rGO sheets by heating the mixed solution of rGOand chloroauric acid at 65?C using EGCG as reductant. Transmission electron microscopy(TEM), atomic force microscope (AFM) and X-ray photoelectron spectroscopy (XPS) wereemployed to characterize the resulting nanocomposite. Due to the chelating e®ect of polyhydroxyEGCG, AuNPs with diameters of ? 20 – 50 nm were stably decorated onto both sides of the rGOsheets. Because this reduction method avoids the use of toxic reagents, AuNPs/rGO nano-composite would be eco-friendly, and it might be useful not only for electronic devices but also forbiocompatible materials in the future applications.
SHIYONG BAO,HAN ZHU,PAN WANG,MEILING ZOU,MINGLIANG DU,MING ZHANG 성균관대학교(자연과학캠퍼스) 성균나노과학기술원 2013 NANO Vol.8 No.6
A facile and green route was introduced to synthesize Pt nanoparticles (PtNPs) immobilized on Cu2O octahedrons to form Cu2O–Pt hierarchical heterostructure. Transmission electron microscopy (TEM), field emission scanning electron microscopy (FE-SEM), high resolution transmission electron microscopy (HRTEM), X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) were employed to study their morphology, chemical and crystallographic properties of the Cu2O–Pt hierarchical heterostructure. These novel Cu2O–Pt hierarchical heterostructures show fascinating degradations of methylene blue (MB), due to the suppressed electron/hole recombination phenomena and the efficient ability to capture the light.