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Hyeon Gyu Beom,Kyoung Moon Jeong,Eun Do Jeong 대한기계학회 2002 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.16 No.8
A conducting crack in an electrostrictive ceramic under combined electric and mechanical loading is investigated. Analysis based on linear dielectric model predicts that the surfaces of the crack are not open completely but they are contact near the crack tip. The complete solution for the crack with a contact zone in a linear electrostrictive ceramic under combined electric and mechanical loading is obtained by using the complex variable formula. The asymptotic problems for a semi-infinite crack with a partial opening zone as well as for a fully open semi-infinite crack in a nonlinear electrostrictive ceramic are analyzed in order to investigate the effect of the electrical nonlinearity on the stress intensity factor under small scale nonlinear conditions. Particular attention is devoted to a finite crack in the nonlinear electrostrictive ceramic subjected to combined electric and mechanical loading. The stress intensity factor for the finite crack under small scale nonlinear conditions is obtained from the asymptotic analysis.<br/>
Path Stability of a Crack with an Eigenstrain
Hyeon Gyu Beom,Yu Hwan Kim,Chongdu Cho,Chang-Boo Kim 대한기계학회 2006 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.20 No.9
A slightly curved crack with an eigenstrain is considered. Solutions for a slightly curved crack in a linear isotropic material under asymptotic loading as well as for a slightly curved crack in a linear isotropic material with a concentrated force are obtained from perturbation analyses, which are accurate to the first order of the parameter representing the non-straightness. Stress intensity factors for a slightly curved crack with an eigenstrain are obtained from the perturbation solutions by using a body force analogy. Particular attention is given to the crack path stability under mode I loading. A new parameter of crack path stability is proposed for a crack with an eigenstrain. The path stability of a crack with steady state growth in a transforming material and a ferroelectric material is examined.
Evaluation of Thermal Deformation in Electronic Packages
Beom, Hyeon-Gyu,Jeong, Kyoung-Moon The Korean Society of Mechanical Engineers 2000 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.14 No.2
Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.
Beom, Hyeon-Gyu,Jeong, Kyoung-Moon,Jeong, Eun-Do The Korean Society of Mechanical Engineers 2002 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.16 No.8
A conducting crack in an electrostrictive ceramic under combined electric and mechanical loading is investigated. Analysis based on linear dielectric model predicts that the surfaces of the crack are not open completely but they are contact near the crack tip. The complete solution for the crack with a contact zone in a linear electrostrictive ceramic under combined electric and mechanical loading is obtained by using the complex variable formula. The asymptotic problems for a semi-infinite crack with a partial opening zone as well as for a fully open semi-infinite crack in a nonlinear electrostrictive ceramic are analyzed in order to investigate the effect of the electrical nonlinearity on the stress intensity factor under small scale nonlinear conditions. Particular attention is devoted to a finite crack in the nonlinear electrostrictive ceramic subjected to combined electric and mechanical loading. The stress intensity factor for the finite crack under small scale nonlinear conditions is obtained from the asymptotic analysis.
Analysis of a Wedge in an Anisotropic Bimaterial under Antiplane Loads
Beom, Hyeon-Gyu,Jang, Hyun-Seok 한국정밀공학회 2012 International Journal of Precision Engineering and Vol.13 No.4
An anisotropic bimaterial wedge under antiplane shear is investigated. The problem is formulated by using a linear transformation method. Employing complex function representations of elastic fields, a complete form of elastic fields near the apex of an anisotropic composite wedge is derived. An anisotropic composite wedge subjected to concentrated loads is also analyzed. The transformed isotropic bimaterial wedge is first solved, and the solution for the anisotropic wedge is then obtained based on the linear transformation method. Expressions of the stress intensity factor for the composite wedge are obtained. Numerical computations are carried out to obtain the order of stress singularity and the stress intensity factors for three types of wedge shapes.
Path Stability of a Crack with an Eigenstrain
Beom, Hyeon-Gyu,Kim, Yu-Hwan,Cho, Chong-Du,Kim, Chang-Boo The Korean Society of Mechanical Engineers 2006 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY Vol.20 No.9
A slightly curved crack with an eigenstrain is considered. Solutions for a slightly curved crack in a linear isotropic material under asymptotic loading as well as for a slightly curved crack in a linear isotropic material with a concentrated force are obtained from perturbation analyses, which are accurate to the first order of the parameter representing the non-straightness. Stress intensity factors for a slightly curved crack with an eigenstrain are obtained from the perturbation solutions by using a body force analogy. Particular attention is given to the crack path stability under mode I loading. A new parameter of crack path stability is proposed for a crack with an eigenstrain. The path stability of a crack with steady state growth in a transforming material and a ferroelectric material is examined.
Analysis of a Thin Electrode Layer between Two Dissimilar Piezoelectric Solids
Beom, Hyeon Gyu,Kim, Y.H.,Cho, C.,Kim, Chang Boo Trans Tech Publications 2007 Key Engineering Materials Vol.353-358 No.3
<P>A thin electrode layer at the interface between two dissimilar linear piezoelectric materials under electromechanical loading is investigated. The complex function theory is employed to obtain the exact solution to a finite thin conductive layer. Special consideration is devoted to the structure of singular stress and electric fields near the tip of the thin electrode between two dissimilar piezoelectric materials. The stress and electric field are found to have an inverse square root singularity. The electric field intensity factor characterizes uniquely the singular fields close to the edge of the conductive line sheet.</P>