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H. J. Park(박한준),J. Lee(이지훈),M. K. Kwak(곽문규) Korean Society for Precision Engineering 2021 한국정밀공학회 학술발표대회 논문집 Vol.2021 No.11월
Shape memory polymer (SMP) is a material that can return a polymer chain in a temporarily deformed state to its initial state by specific stimuli such as heat, light, or magnetism. SMPs, as an important class of smart materials, have attracted the attention of academia and industry. In the past few years, the basic principles of SMPs have been well established and have facilitated research to design various types of SMPs at the molecular structure level. In this work, we report a robust design of thermally actuated switchable, microstructured dry adhesive. The SMP dry adhesive is fabricated using thermal reactive epoxy-based shape memory polymer and can be manufactured very quickly and simply through the UV curing process. It is demonstrated that SMP dry adhesive deform to adapt to the glass substrate to generate a compelling adhesion (Up to 20 N/cm² in Pull-off Strength) and also induce detachment by restoring its original shape (Down to 2.02 N/cm² in Pull-off Strength). Also, since the UV curing process is very simple and done quickly, the suggested fabrication method can be easily applicable to the R2R continuous fabrication process. For the feasible application, the fabricated SMP dry adhesive was used for glass transportation experiment.